M36P0R9070E0ZAC STMICROELECTRONICS [STMicroelectronics], M36P0R9070E0ZAC Datasheet - Page 22

• Manufacturer Part Number: M36P0R9070E0ZAC
• Description: 512 Mbit (x16, Multiple Bank, Multi-Level, Burst) Flash Memory 128 Mbit (Burst) PSRAM, 1.8V Supply, Multi-Chip Package
• Manufacturer: STMICROELECTRONICS [STMicroelectronics]

6 Package mechanical
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Package mechanical
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second-level interconnect. The category of
Second-Level Interconnect is marked on the package and on the inner box label, in compliance
with JEDEC Standard JESD97.
The maximum ratings related to soldering conditions are also marked on the inner box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Figure 5.
1. Drawing is not to scale.
TFBGA107 8x11mm - 9x12 active ball array, 0.8mm pitch, package outline
E
E1
BALL "B1"
FD
A
e
D1
D
b
A1
FE
e
SE
A2
BGA-Z85
M36P0R9070E0
ddd