CBT3244APW,118 NXP Semiconductors, CBT3244APW,118 Datasheet - Page 16

• Manufacturer Part Number: CBT3244APW,118
• Description: IC BUS SW OCTAL 8BIT 20-TSSOP
• Manufacturer: NXP Semiconductors
• Series: 74CBTr
• Type: Bus Switchr

Specifications of CBT3244APW,118

• Package / Case: 20-TSSOP
• Circuit: 4 x 1:1
• Independent Circuits: 2
• Current - Output High, Low: 15mA, 64mA
• Voltage Supply Source: Single Supply
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Number Of Switches: Octal
• Propagation Delay Time: 0.25 ns
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 4.5 V
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Logic Family: CBT
• Mounting Style: SMD/SMT
• On Resistance (max): 8 Ohms
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 568-1868-2; 935275527118; CBT3244APW-T

Philips Semiconductors
14. Abbreviations
15. Revision history
Table 11:
9397 750 13362
Product data sheet
Document ID
CBT3244_2
Modifications:
CBT3244A_1
Revision history
Release date
20050915
20040526
•
•
•
•
[4]
[5]
[6]
[7]
[8]
[9]
Table 10:
Acronym
CDM
ESD
HBM
MM
PRR
TTL
The format of this data sheet has been redesigned to comply with the new presentation and
information standard of Philips Semiconductors.
added DHVQFN20 package option (affects
information”,
Section 2 “Features” on page
2000 V HBM ...’
added
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
Hot bar soldering or manual soldering is suitable for PMFP packages.
Section 14 “Abbreviations” on page 16
Abbreviations
Data sheet status
Product data sheet
Product data sheet
Section 5 “Pinning
Description
Charged Device Model
ElectroStatic Discharge
Human Body Model
Machine Model
Pulse Rate Repetition
Transistor-Transistor Logic
Rev. 02 — 15 September 2005
1, 6th bullet: changed from ‘exceeds 1000 V HBM ...’ to ‘exceeds
information”, and
Change notice
-
-
Section 2
Octal bus switch with quad output enables
Section 12 “Package outline”
“Features”,
Doc. number
9397 750 13362
9397 750 13281
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Section 3 “Ordering
CBT3244A
Supersedes
CBT3244A_1
-
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