K4D263238A-GC36 SAMSUNG [Samsung semiconductor], K4D263238A-GC36 Datasheet - Page 2

• Manufacturer Part Number: K4D263238A-GC36
• Description: 1M x 32Bit x 4 Banks Double Data Rate Synchronous DRAM with Bi-directional Data Strobe and DLL
• Manufacturer: SAMSUNG [Samsung semiconductor]

128M DDR SDRAM
K4D263238A-GC
Revision History
Revision 2.0 (January 16, 2002)
• Changed package ball height from 0.25mm to 0.35mm
• Typo corrected
Revision 1.9 (July 18, 2002)
• Changed power dissipation from 2.0W to 2.3W
Revision 1.8 (June 12, 2002)
• Supported both CL4 and CL3 for the K4D263238A-GC45 and the effective date of this change starts from
WW23
Revision 1.6 (January 30, 2002)
• Changed tCK(max) of K4D263238A-GC40 from 7ns to 10ns.
• Changed tCK(max) of K4D263238A-GC33/36 from 5ns to 4ns.
For all the CL5 operation, guaranteed tCK(max) is 4ns.
Revision 1.5 (December 14, 2001)
• Removed K4D26323RA-GC2A/33/36(VDD/VDDQ=2.8V) & K4D263238A-GC55/60 from the spec.
• Added K4D263238A-GC36(VDD/VDDQ=2.5V)
Revision 1.4 (November 14, 2001)
• Added K4D26323RA-GC36(VDD/VDDQ=2.8V)
Revision 1.3 (October 22, 2001)
• Corrected part number of K4D263238A-GC2A to K4D26323RA-GC2A
• Changed tCDLR of -GC2A and GC33 from 3tCK to 2tCK and applied since Sept 15, 2001.
• Defined x32 DDR for mobile PC graphics separately - K4D26323AA-GL** featured with VDDQ=1.8V,ICC6=1mA with
reduced operating current. Refer to the K4D26323AA-GL** spec for more detail information.
Revision 1.2 (September 13, 2001)
• Define DC spec value of K4D26323RA-GC33 and K4D263238A-GC2A
• Changed tCK(max) of -2A and -33 from 7ns to 5ns
Revision 1.1 (September 3, 2001)
• Added K4D26323RA-GC33(VDD/VDDQ=2.8V)
• Added K4D263238A-GC2A(350MHz)
Revision 1.0 (August 16, 2001)
• Changed tCDLR of K4D263238A-GC33 from 2tCK to 3tCK
• Removed VDDQ=1.8V from the spec.
• Added K4D263238A-GL as a low power part
• Defined DC spec.
Revision 0.1 (August 2, 2001) -
Target Spec
• Changed tCK(max) of K4D263238A-GC45/-50/-55/-60 from 7ns to 10ns.
Revision 0.0 (June, 2001) -
Target Spec
• Defined Target Specification
Rev. 2.0 (Jan. 2003)
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