K4T56163QI-ZCLCC SAMSUNG [Samsung semiconductor], K4T56163QI-ZCLCC Datasheet - Page 2

no-image

K4T56163QI-ZCLCC

Manufacturer Part Number
K4T56163QI-ZCLCC
Description
256Mb I-die DDR2 SDRAM Specification
Manufacturer
SAMSUNG [Samsung semiconductor]
Datasheet
Table of Contents
1.0 Ordering Information ....................................................................................................................4
2.0 Key Features .................................................................................................................................4
3.0 Package Pinout/Mechanical Dimension & Addressing .............................................................5
4.0 Input/Output Functional Description ..........................................................................................7
5.0 DDR2 SDRAM Addressing ...........................................................................................................8
6.0 Absolute Maximum DC Ratings ...................................................................................................9
7.0 AC & DC Operating Conditions ...................................................................................................9
8.0 ODT DC electrical characteristics .............................................................................................11
9.0 OCD default characteristics ......................................................................................................12
10.0 IDD Specification Parameters and Test Conditions ..............................................................13
11.0 DDR2 SDRAM IDD Spec ...........................................................................................................15
12.0 Input/Output capacitance .........................................................................................................16
13.0 Electrical Characteristics & AC Timing for DDR2-800/667/533/400 ......................................16
14.0 General notes, which may apply for all AC parameters ........................................................19
15.0 Specific Notes for dedicated AC parameters ..........................................................................21
K4T56163QI
3.1 x16 package pinout (Top View) : 84ball FBGA Package
3.2 FBGA Package Dimension(x16)
7.1 Recommended DC Operating Conditions (SSTL - 1.8)
7.2 Operating Temperature Condition
7.3 Input DC Logic Level
7.4 Input AC Logic Level
7.5 AC Input Test Conditions
7.6 Differential input AC logic Level
7.7 Differential AC output parameters
13.1 Refresh Parameters by Device Density
13.2 Speed Bins and CL, tRCD, tRP, tRC and tRAS for Corresponding Bin
13.3 Timing Parameters by Speed Grade
....................................................................................................................10
....................................................................................................................10
..............................................................................................................10
.......................................................................................................6
.....................................................................................................11
..................................................................................................10
..................................................................................................11
............................................................................................17
........................................................................................16
2 of 42
.........................................................................9
.......................................................................5
.............................................16
Rev. 1.0 October 2007
DDR2 SDRAM

Related parts for K4T56163QI-ZCLCC