M393B1G70EM1 SAMSUNG [Samsung semiconductor], M393B1G70EM1 Datasheet - Page 15
M393B1G70EM1
Manufacturer Part Number
M393B1G70EM1
Description
DDR3 SDRAM Memory
Manufacturer
SAMSUNG [Samsung semiconductor]
Datasheet
1.M393B1G70EM1.pdf
(23 pages)
- Current page: 15 of 23
- Download datasheet (722Kb)
Product Guide
78Ball DDP for 2Gb C-die (x4/x8)
78Ball for 4Gb A-die (x4/x8)
(Post Reflow ∅0.50 ± 0.05)
(Post Reflow ∅0.50 ± 0.05)
(Datum A)
78 - ∅0.45 Solder ball
78 - ∅0.45 Solder ball
(Datum A)
(Datum B)
(Datum B)
0.2
0.2
M
M
G
M
A
B
C
D
E
F
H
K
N
J
L
A B
A B
M
A
B
C
D
E
G
H
K
N
F
J
L
9
9
0.80
8 7 6 5 4 3 2 1
BOTTOM VIEW
8 7 6 5 4 3 2 1
BOTTOM VIEW
0.80
0.80
0.80 x 8 = 6.40
10.00 ± 0.10
8.00 ± 0.10
1.60
(1.90)
x 8 = 6.40
1.60
(0.95)
3.20
3.20
MOLDING AREA
A
A
#A1 INDEX MARK
#A1 INDEX MARK
B
B
- 15 -
#A1
#A1
TOP VIEW
10.00 ± 0.10
TOP VIEW
8.00 ± 0.10
DDR3 SDRAM Memory
1.40 ± 0.10
May. 2010
0.35 ± 0.05
1.10 ± 0.10
0.35 ± 0.05
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