M393B1G70EM1 SAMSUNG [Samsung semiconductor], M393B1G70EM1 Datasheet - Page 20
M393B1G70EM1
Manufacturer Part Number
M393B1G70EM1
Description
DDR3 SDRAM Memory
Manufacturer
SAMSUNG [Samsung semiconductor]
Datasheet
1.M393B1G70EM1.pdf
(23 pages)
- Current page: 20 of 23
- Download datasheet (722Kb)
May. 2010
Product Guide
DDR3 SDRAM Memory
3. CLIP PART
39.3 ±
0.2
Upper Bending
Tilting Gap
29.77
0.1 ~ 0.3
A
B
C
0.5
4. DDR3 RDIMM ASS’Y View
Reference thickness total (Maximum) : Mono Package : 7.55mm, DDP Package 7.71mm (With Clip thickness)
132.95
133.45
±
39.3 ±
0.2
D
K
E (Clip open size)
text mark ’B’ or ’K’
punch press_stamp
- 20 -
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