M368L3223ETM-CLCC4 SAMSUNG [Samsung semiconductor], M368L3223ETM-CLCC4 Datasheet - Page 14

• Manufacturer Part Number: M368L3223ETM-CLCC4
• Description: DDR SDRAM Unbuffered Module
• Manufacturer: SAMSUNG [Samsung semiconductor]

256MB, 512MB Unbuffered DIMM
Table 4 : Input/Output Setup & Hold Derating for Rise/Fall Delta Slew Rate
Table 5 : Output Slew Rate Characteristice (X8 Devices only)
Table 6 : Output Slew Rate Characteristice (X16 Devices only)
Table 7 : Output Slew Rate Matching Ratio Characteristics
System Characteristics for DDR SDRAM
The following specification parameters are required in systems using DDR400 devices to ensure proper system perfor-
mance. these characteristics are for system simulation purposes and are guaranteed by design.
Table 1 : Input Slew Rate for DQ, DQS, and DM
Table 2 : Input Setup & Hold Time Derating for Slew Rate
Table 3 : Input/Output Setup & Hold Time Derating for Slew Rate
PARAMETER
DQ/DM/DQS input slew rate measured between
VIH(DC), VIL(DC) and VIL(DC), VIH(DC)
PARAMETER
Output Slew Rate Matching Ratio (Pullup to Pulldown)
Slew Rate Characteristic
Slew Rate Characteristic
Delta Slew Rate
Input Slew Rate
Input Slew Rate
+/- 0.25 V/ns
+/- 0.0 V/ns
+/- 0.5 V/ns
Pullup Slew Rate
Pullup Slew Rate
0.5 V/ns
0.4 V/ns
0.3 V/ns
0.5 V/ns
0.4 V/ns
0.3 V/ns
Pulldown slew
Pulldown slew
AC CHARACTERISTICS
AC CHARACTERISTICS
+100
+100
+150
+50
+75
tDS
+50
tDS
tIS
0
0
0
Typical Range
Typical Range
1.2 ~ 2.5
1.2 ~ 2.5
1.2 ~ 2.5
1.2 ~ 2.5
(V/ns)
(V/ns)
+100
+150
tDH
+50
tDH
+75
tIH
0
0
0
0
0
Minimum
Minimum
(V/ns)
(V/ns)
1.0
1.0
0.7
0.7
DCSLEW
SYMBOL
MIN
-
DDR400
Units
Units
Units
ps
ps
ps
ps
ps
ps
ps
ps
ps
Maximum
Maximum
MAX
MIN
(V/ns)
(V/ns)
0.5
-
4.5
4.5
5.0
5.0
DDR400
Notes
Notes
Notes
MAX
4.0
h
h
h
i
i
i
Notes
j
j
j
e,k
a,c,d,f,g
b,c,d,f,g
a,c,d,f,g
b,c,d,f,g
Notes
Notes
Units
V/ns
Notes
a, k
Rev. 1.3 August. 2003
DDR SDRAM