HS9-26CT31RH/PROTO INTERSIL [Intersil Corporation], HS9-26CT31RH/PROTO Datasheet
HS9-26CT31RH/PROTO
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HS9-26CT31RH/PROTO Summary of contents
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... MKT. NUMBER 5962F9563201QEC HS1-26CT31RH-8 5962F9563201QXC HS9-26CT31RH-8 5962F9563201VEC HS1-26CT31RH-Q 5962F9563201VXC HS9-26CT31RH-Q HS1-26CT31RH/PROTO HS1-26CT31RH/PROTO HS9-26CT31RH/PROTO HS9-26CT31RH/PROTO 5962F9563201V9A HS0-26CT31RH-Q 5962F9563202VXC HS9-26CT31EH-Q 1 February 23, 2012 FN2929.4 Features • Electronically Screened to SMD #5962-95632 • QML Qualified Per MIL-PRF-38535 Requirements • 1.2 Micron Radiation Hardened CMOS • Total Dose Up to 300kRAD(Si) • ...
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... HS-26CT31RH, HS-26CT31EH 16 VDD AIN 15 DIN ENABLE ENABLE BIN 10 CO GND 9 CIN DIN CIN HS9-26CT31RH, HS-26CT31EH (16 LD FLATPACK) CDFP4-F16 TOP VIEW BIN AIN VDD DIN DO DO ...
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Die Characteristics DIE DIMENSIONS: 96.5 milx195 milsx21 mils (2450x4950) INTERFACE MATERIALS: Glassivation: Type: PSG (Phosphorus Silicon Glass) ± 1k Å Å Thickness: 10k Metallization: M1: Mo/TiW Å Thickness: 5800 M2: Al/Si/Cu (Top) ±1k Å Å Thickness: 10k 3 HS-26CT31RH, HS-26CT31EH ...
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Metallization Mask Layout ENABLE (4) Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems as noted in the quality certifications found at Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in ...