MPXH6250A_09 FREESCALE [Freescale Semiconductor, Inc], MPXH6250A_09 Datasheet - Page 4

• Manufacturer Part Number: MPXH6250A_09
• Description: High Temperature Accuracy Integrated Silicon Pressure Sensor
• Manufacturer: FREESCALE [Freescale Semiconductor, Inc]

MPXH6250A
4
On-chip Temperature Compensation and Calibration
Super Small Outline chip carrier (Case 1317).
illustrates a typical application circuit (output source current
operation).
pressure input. Typical minimum and maximum output
curves are shown for operation over 0 to 85°C temperature
range. The output will saturate outside of the rated pressure
range.
Figure 2
Figure 4
Pressure
illustrates the absolute sensing chip in the basic
shows the sensor output signal relative to
Lead Frame
Sealed Vacuum Reference
100 nF
Wire Bond
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
Fluorosilicone
0
Gel Die Coat
Figure 2. Cross Sectional Diagram SSOP
Transfer Function:
V
V
Temperature = 0 to 85°C
Figure 4. Output vs. Absolute Pressure
out
S
Figure 3. Typical Application Circuit
(Output Source Current Operation)
= 5.1 Vdc
= V
Figure 3
+5.1 V
V
GND Pin 3
s
*(0.0040*P-0.040) ± Error
S
Pressure (Reference to Sealed Vacuum) in kPa
MPXH6250A
Pin 2
MAX
Absolute Element
V
OUT
(not to scale)
Pin 4
P1
MIN
from the environment, while allowing the pressure signal to
be transmitted to the silicon diaphragm. The MPXH6250A
series pressure sensor operating characteristics, internal
reliability and qualification tests are based on use of dry air as
the pressure media. Media other than dry air may have
adverse effects on sensor performance and long-term
reliability. Contact the factory for information regarding media
compatibility in your application.
A fluorosilicone gel isolates the die surface and wire bonds
Die
47 pF
Die Bond
TYP
Stainless Steel Cap
51 K
Thermoplastic Case
To ADC
Freescale Semiconductor
Sensors