HCTS10K INTERSIL [Intersil Corporation], HCTS10K Datasheet - Page 8
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HCTS10K
Manufacturer Part Number
HCTS10K
Description
Radiation Hardened Triple 3-Input NAND Gate
Manufacturer
INTERSIL [Intersil Corporation]
Datasheet
1.HCTS10K.pdf
(9 pages)
Die Characteristics
DIE DIMENSIONS:
METALLIZATION:
GLASSIVATION:
WORST CASE CURRENT DENSITY:
BOND PAD SIZE:
Metallization Mask Layout
87 x 88 mils
2.20 x 2.24mm
Type: SiAl
Metal Thickness: 11k
Type: SiO
Thickness: 13k
<2.0 x 10
100 m x 100nm
4 x 4 mils
B1 (2)
A2 (3)
B2 (4)
C2 (5)
5
2
A/cm
Å
2
2.6k
Å
Å
1k
Å
A1
(1)
(6)
Y2
HCTS10MS
HCTS10MS
GND
VCC
(14)
(7)
8
(13)
(8)
Y3
C1
Spec Number
(12) Y1
(11) C3
(10) B3
(9) A3
518778