HCTS112HMSR INTERSIL [Intersil Corporation], HCTS112HMSR Datasheet - Page 9

• Manufacturer Part Number: HCTS112HMSR
• Description: Radiation Hardened Dual JK Flip-Flop
• Manufacturer: INTERSIL [Intersil Corporation]

Die Characteristics
DIE DIMENSIONS:
METALLIZATION:
GLASSIVATION:
WORST CASE CURRENT DENSITY:
BOND PAD SIZE:
Metallization Mask Layout
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
89 x 88 mils
2.25 x 2.24mm
Type: SiAl
Metal Thickness: 11k
Type: SiO
Thickness: 13k
<2.0 x 10
100 m x 100 m
4 mils x 4 mils
The mask series for the HCTS112 is TA14441A.
Q1 (5)
Q1 (6)
Q2 (7)
S1 (4)
J1 (3)
5
2
A/cm
Å
2
2.6k
Å
Å
1k
Å
GND
K1
(2)
(8)
HCTS112MS
HCTS112MS
CP1
(1)
Q2
(9)
498
(10)
VCC
(16)
S2
Spec Number
(15) R1
(14) R2
(13) CP2
(12) K2
(11) J2
518603