HCTS157HMSR INTERSIL [Intersil Corporation], HCTS157HMSR Datasheet - Page 9
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HCTS157HMSR
Manufacturer Part Number
HCTS157HMSR
Description
Radiation Hardened Quad 2-Input Multiplexers
Manufacturer
INTERSIL [Intersil Corporation]
Datasheet
1.HCTS157HMSR.pdf
(10 pages)
Die Characteristics
DIE DIMENSIONS:
METALLIZATION:
GLASSIVATION:
WORST CASE CURRENT DENSITY:
BOND PAD SIZE:
Metallization Mask Layout
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
84 x 84 mils
Type: SiAl
Metal Thickness: 11k
Type: SiO
Thickness: 13k
<2.0 x 10
100 m x 100 m
4 mils x 4 mils
The mask series for the HCTS157 is TA14471A.
2I1 (6)
1I1 (3)
2I0 (5)
1Y (4)
5
2
A/cm
Å
2
2.6k
Å
Å
1k
Å
1I0
(2)
(7)
2Y
HCTS157MS
(1)
S
HCTS157MS
GND
(8)
558
VCC
(16)
(9)
3Y
(15)
E
Spec Number
(14) 4I0
(13) 4I1
(12) 4Y
(11) 3I0
(10) 3I1
518610