HCTS164D INTERSIL [Intersil Corporation], HCTS164D Datasheet
HCTS164D
Related parts for HCTS164D
HCTS164D Summary of contents
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... Parallel-Out Shift Register with asynchronous reset. The HCTS164MS utilizes advanced CMOS/SOS technology to achieve high-speed operation. This device is a member of the radiation hardened, high-speed, CMOS/SOS Logic Family. Ordering Information PART NUMBER TEMPERATURE RANGE HCTS164DMSR -55 HCTS164KMSR -55 HCTS164D/Sample HCTS164K/Sample HCTS164HMSR Truth Table OPERATING MODE MR Reset (Clear) L Shift H ...
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Functional Diagram CP DS1 DS2 MR HCTS164MS ...
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Absolute Maximum Ratings Supply Voltage (VCC -0.5V to +7.0V Input Voltage Range, All Inputs . . ...
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TABLE 2. AC ELECTRICAL PERFORMANCE CHARACTERISTICS PARAMETER SYMBOL TPLH VCC = 4.5V VCC = 4. TPHL VCC = 4.5V VCC = 4. TPHL VCC = 4.5V VCC = 4.5V NOTES: 1. ...
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TABLE 4. DC POST RADIATION ELECTRICAL PERFORMANCE CHARACTERISTICS (Continued) PARAMETERS SYMBOL TPLH TPHL TPHL NOTES: 1. All voltages referenced to device GND measurements assume RL = 500Ω ...
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TABLE 8. STATIC AND DYNAMIC BURN-IN TEST CONNECTIONS OPEN GROUND STATIC BURN-IN I TEST CONNECTIONS (Note STATIC BURN-IN II TEST CONNECTIONS (Note ...
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Die Characteristics DIE DIMENSIONS: 95 mils x 95 mils 2.380mm x 2.410mm METALLIZATION: Type: AlSi ±1k Å Å Metal Thickness: 11k GLASSIVATION: Type: SiO 2 ±2.6k Å Å Thickness: 13k Metallization Mask Layout DS2 (2) Q0 (3) Q1 (4) NC ...
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Intersil Space Level Product Flow - MS Wafer Lot Acceptance, All Lots (including SEM); Method 5007 Gamma Radiation Verification, Each Wafer, 4 Samples/ Wafer, 0 Rejects, Method 1019 100% Nondestructive Bond Pull, Method 2023 Sample Wire Bond Pull Monitor, Method ...