HCTS85HMSR INTERSIL [Intersil Corporation], HCTS85HMSR Datasheet

HCTS85HMSR

Manufacturer Part Number

HCTS85HMSR

Description

Radiation Hardened 4-Bit Magnitude Comparator

Manufacturer

INTERSIL [Intersil Corporation]

Datasheet

1.HCTS85HMSR.pdf (10 pages)

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September 1995

CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.

http://www.intersil.com or 407-727-9207

Features

• 3 Micron Radiation Hardened SOS CMOS

• Total Dose 200K RAD (Si)

• SEP Effective LET No Upsets: >100 MEV-cm

• Single Event Upset (SEU) Immunity < 2 x 10

• Dose Rate Survivability: >1 x 10

• Dose Rate Upset >10

• Latch-Up Free Under Any Conditions

• Fanout (Over Temperature Range)

• Military Temperature Range: -55

• Signiﬁcant Power Reduction Compared to LSTTL ICs

• DC Operating Voltage Range: 4.5V to 5.5V

• LSTTL Input Compatibility

• Input Current Levels Ii

Description

The Intersil HCTS85MS is a Radiation Hardened 4-bit high

speed magnitude comparator. This device compares two

binary, BCD, or other monotonic codes and presents the

three possible magnitude results at the outputs (A>B, A<B,

and A=B). The 4-bit input words are weighted (A0 to A3 and

B0 to B3), where A3 and B3 are the most signiﬁcant bits.

The HCTS85MS is expandable without external gating, both

serial and parallel operation.

The HCTS85MS utilizes advanced CMOS/SOS technology

to achieve high-speed operation. This device is a member of

radiation hardened, high-speed, CMOS/SOS Logic Family

with TTL input compatibility.

The HCTS85MS is supplied in a 16 lead Ceramic ﬂatpack

(K sufﬁx) or a SBDIP Package (D sufﬁx).

Ordering Information

HCTS85DMSR

HCTS85KMSR

HCTS85D/Sample

HCTS85K/Sample

HCTS85HMSR

Bit-Day (Typ)

-Standard Outputs: 10 LSTTL Loads

-VIL = 0.8V Max

-VIH = VCC/2 Min

PART NUMBER

RAD (Si)/s 20ns Pulse

5 A at VOL, VOH

TEMPERATURE RANGE

C to +125

RAD (Si)/s

-55

Intersil Corporation 1999

C to +125

+25

/mg

-9

Errors/

Pinouts

Intersil Class S Equivalent

Sample

Die

(A<B)OUT

(A=B)OUT

(A>B)OUT

16 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE

(A<B)IN

(A=B)IN

(A>B)IN

16 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE

(FLATPACK) MIL-STD-1835 CDFP4-F16, LEAD FINISH C

SCREENING LEVEL

GND

(SBDIP) MIL-STD-1835 CDIP2-T16, LEAD FINISH C

HCTS85MS

(A<B)OUT

(A=B)OUT

(A>B)OUT

(A<B)IN

(A=B)IN

(A>B)IN

4-Bit Magnitude Comparator

GND

TOP VIEW

Radiation Hardened

16 Lead SBDIP

16 Lead Ceramic Flatpack

16 Lead SBDIP

16 Lead Ceramic Flatpack

Die

Spec Number

File Number

PACKAGE

VCC

518624

3059.1

VCC

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HCTS85HMSR Summary of contents

Page 1

... SBDIP Package (D sufﬁx). Ordering Information PART NUMBER TEMPERATURE RANGE HCTS85DMSR HCTS85KMSR HCTS85D/Sample HCTS85K/Sample HCTS85HMSR CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. | http://www.intersil.com or 407-727-9207 Copyright HCTS85MS Pinouts 16 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE ...

Page 2

Functional Block Diagram (A> (A=B) ...

Page 3

Absolute Maximum Ratings Supply Voltage (VCC -0.5V to +7.0V Input Voltage Range, All Inputs . . ...

Page 4

TABLE 2. AC ELECTRICAL PERFORMANCE CHARACTERISTICS PARAMETER SYMBOL An to (A>B)OUT TPHL, VCC = 4.5V TPLH Bn to (A>B)OUT TPHL, VCC = 4.5V TPLH An (A<B)OUT TPHL, VCC = 4.5V TPLH An (A=B)OUT TPHL, VCC = ...

Page 5

TABLE 4. DC POST RADIATION ELECTRICAL PERFORMANCE CHARACTERISTICS PARAMETER SYMBOL Quiescent Current ICC VCC = 5.5V, VIN = VCC or GND Output Current (Sink) IOL VCC = 4.5V, VIN = VCC or GND, VOUT = 0.4V Output Current IOH VCC ...

Page 6

CONFORMANCE GROUPS Initial Test (Preburn-In) Interim Test I (Postburn-In) Interim Test II (Postburn-In) PDA Interim Test III (Postburn-In) PDA Final Test Group A (Note 1) Group B Subgroup B-5 Subgroup B-6 Group D NOTES: 1. Alternate Group A testing in ...

Page 7

Intersil Space Level Product Flow - ‘MS’ Wafer Lot Acceptance (All Lots) Method 5007 (Includes SEM) GAMMA Radiation Veriﬁcation (Each Wafer) Method 1019, 4 Samples/Wafer, 0 Rejects 100% Nondestructive Bond Pull, Method 2023 Sample - Wire Bond Pull Monitor, Method ...

Page 8

AC Timing Diagrams VIH INPUT VS VIL TPLH VOH VS OUTPUT VOL TTLH VOH 80% 20% OUTPUT VOL AC VOLTAGE LEVELS PARAMETER HCTS VCC 4.50 VIH 3.00 VS 1.30 VIL 0 GND 0 HCTS85MS AC Load Circuit DUT TPHL CL ...

Page 9

Die Characteristics DIE DIMENSIONS: 100 x 100 mils METALLIZATION: Type: SiAl Å Å Metal Thickness: 11k 1k GLASSIVATION: Type: SiO 2 Å Å Thickness: 13k 2.6k WORST CASE CURRENT DENSITY <2 A/cm BOND PAD SIZE: 100 ...

Page 10

All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certiﬁcation. Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or speciﬁcations at any time without notice. Accordingly, ...

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