LGA-THSK-KIT-045 EMERSON-NETWORKPOWER [Emerson Network Power], LGA-THSK-KIT-045 Datasheet - Page 8

• Manufacturer Part Number: LGA-THSK-KIT-045
• Description: Embedded Power Device
• Manufacturer: EMERSON-NETWORKPOWER [Emerson Network Power]

Technical Reference Note
Applications (cont'd)
Setting Margin Control (cont'd)
Water Washing
Water-washing is not recommended.
Interface Finish
Electroless Nickel Immersion Gold (ENIG).
Solder Paste
Solderballs are caused between LGA and substrate due to printing an excessive amount of solderpaste.
Stencil apertures should be windowpaned; dividing them into quadrants rather than printing a continuous
deposit over the entire pad. This will control the amount of solder available to form a joint between LGA
and customer board. Additionally, this will also reduce the formation of voids.
Solder Paste Window Paning
Margin Up and Down 5%
Margin Up and Down 10%
Vout_nom (V)
0.9
1.2
1.8
2.5
3.3
5.0
0.9
1.2
1.8
2.5
3.3
5.0
Rtrim (kΩ)
0.976
0.619
0.432
0.267
0.976
0.619
0.432
0.267
3.83
1.96
3.83
1.96
Figure 9: Window Paning
Rmargin (kΩ)
2.49
2.49
2.49
2.49
2.49
2.49
4.99
4.99
4.99
4.99
4.99
4.99
Rofs- (kΩ)
Table 1 - Suggested Margin Values
10.0
10.0
10.0
10.0
10.0
10.0
10.0
10.0
10.0
10.0
10.0
10.0
Rofs+ (kΩ)
10.0
10.0
10.0
10.0
10.0
10.0
10.0
10.0
10.0
10.0
10.0
10.0
Vmargin_down (V) Vout _down (V) Vmargin_up (V)
Figure 10: Window Paning
0.045
0.059
0.090
0.125
0.166
0.250
0.090
0.119
0.180
0.250
0.332
0.501
0.855
1.141
1.710
2.375
3.134
4.750
0.810
1.081
1.620
2.250
2.968
4.499
Embedded Power for
Business-Critical Continuity
0.045
0.059
0.090
0.125
0.166
0.250
0.090
0.199
0.180
0.250
0.332
0.501
Vout_up (V)
0.945
1.259
1.890
2.625
3.466
5.250
0.990
1.319
1.980
2.750
3.632
5.501
Rev. 12.07.09
LGA C Series
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