ESDALC6V1-1BM2_08 STMICROELECTRONICS [STMicroelectronics], ESDALC6V1-1BM2_08 Datasheet - Page 5

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ESDALC6V1-1BM2_08

Manufacturer Part Number
ESDALC6V1-1BM2_08
Description
Single line low capacitance Transil for ESD protection
Manufacturer
STMICROELECTRONICS [STMicroelectronics]
Datasheet
ESDALC6V1-1BM2
3
Note:
Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the inner box label, in compliance with JEDEC
Standard JESD97. The maximum ratings related to soldering conditions are also marked on
the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at
www.st.com.
Table 3.
Product marking may be rotated by 90° for assembly plant differentiation. In no case should
this product marking be used to orient the component for its placement on a PCB. Only pin 1
mark is to be used for this purpose.
Figure 11. Footprint (dimensions in mm) Figure 12. Marking
Epoxy meets UL94, V0
INDEX AREA
(D/2 x E/2)
INDEX AREA
(D/2 x E/2)
OPTIONAL
PIN # 1 ID
0.55
A
SOD882 dimensions
L1
0.40
b1
BOTTOM VIEW
SIDE VIEW
TOP VIEW
0.55
D
e
b2
0.50
E
A1
L2
Ref.
A1
b1
b2
L1
L2
D
A
E
e
Pin1
Min.
0.40
0.00
0.20
0.20
0.45
0.45
Millimeters
Typ.
0.47
0.25
0.25
1.00
0.60
0.65
0.50
0.50
Dimensions
P
Max.
0.50 0.016 0.019 0.020
0.05 0.000
0.30 0.008 0.010 0.012
0.30 0.008 0.010 0.012
0.55 0.018 0.020 0.022
0.55 0.018 0.020 0.022
Package information
Min.
Pin 2
Inches
0.039
0.024
0.026
Typ.
®
0.002
Max.
5/10

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