HMC548LP3E HITTITE [Hittite Microwave Corporation], HMC548LP3E Datasheet - Page 6

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HMC548LP3E

Manufacturer Part Number
HMC548LP3E
Description
SiGe HBT MMIC LOW NOISE AMPLIFIER, 1.2 - 3.0 GHz
Manufacturer
HITTITE [Hittite Microwave Corporation]
Datasheet

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Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HMC548LP3E
Manufacturer:
TI
Quantity:
201
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Manufacturer:
ADI/亚德诺
Quantity:
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Part Number:
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Manufacturer:
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Absolute Maximum Ratings
Outline Drawing
Package Information
[1] Max peak refl ow temperature of 235 °C
[2] Max peak refl ow temperature of 260 °C
[3] 4-Digit lot number XXXX
Drain Bias Voltage (Vcc)
RF Input Power (RFin)(Vcc = +5.0 Vdc)
Junction Temperature
Continuous Pdiss (T = 85 °C)
(derate 14 mW/°C above 85 °C)
Thermal Resistance
(junction to ground paddle)
Storage Temperature
Operating Temperature
ESD Sensitivity (HBM)
HMC548LP3E
Part Number
HMC548LP3
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
RoHS-compliant Low Stress Injection Molded Plastic
Low Stress Injection Molded Plastic
Package Body Material
+7.0 Vdc
-5 dBm
150 °C
0.942 W
69 °C/W
-65 to +150 °C
-40 to +85 °C
Class 1A
v00.0406
Order On-line at www.hittite.com
NOTES:
1. LEADFRAME MATERIAL: COPPER ALLOY
2. DIMENSIONS ARE IN INCHES [MILLIMETERS]
3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE
4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM.
5. PACKAGE WARP SHALL NOT EXCEED 0.05mm.
6. ALL GROUND LEADS AND GROUND PADDLE MUST BE
7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED
100% matte Sn
Sn/Pb Solder
PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM.
SOLDERED TO PCB RF GROUND.
LAND PATTERN.
Lead Finish
HMC548LP3
SiGe HBT MMIC LOW NOISE
AMPLIFIER, 1.2 - 3.0 GHz
MSL Rating
MSL1
MSL1
[1]
[2]
/
548LP3E
Package Marking
XXXX
XXXX
548
548
[3]
5 - 541
5

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