MAS9180ACTC00 MAS [Micro Analog systems], MAS9180ACTC00 Datasheet - Page 12
![no-image](/images/no-image-200.jpg)
MAS9180ACTC00
Manufacturer Part Number
MAS9180ACTC00
Description
AM Receiver IC
Manufacturer
MAS [Micro Analog systems]
Datasheet
1.MAS9180ACTC00.pdf
(15 pages)
SOLDERING INFORMATION
N For Eutectic Sn/Pb TSSOP-16
N For Pb-Free, RoHS Compliant TSSOP-16
Resistance to Soldering Heat
Maximum Temperature
Maximum Number of Reflow Cycles
Reflow profile
Seating Plane Co-planarity
Lead Finish
Resistance to Soldering Heat
Maximum Temperature
Maximum Number of Reflow Cycles
Reflow profile
Seating Plane Co-planarity
Lead Finish
Thermal profile parameters stated in JESD22-A113 should not
Thermal profile parameters stated in IPC/JEDEC J-STD-020
Solder plate 7.62 - 25.4 µm, material Sn 85% Pb 15%
According to RSH test IEC 68-2-58/20 2*220°C
Solder plate 7.62 - 25.4 µm, material Matte Tin
should not be exceeded.
According to RSH test IEC 68-2-58/20
be exceeded.
max 0.08 mm
max 0.08 mm
240°C
http://www.jedec.org
260°C
2
3
http://www.jedec.org
15 September, 2005
DA9180.004
12 (15)