CXP86608 SONY [Sony Corporation], CXP86608 Datasheet - Page 22

• Manufacturer Part Number: CXP86608
• Description: CMOS 8-bit Single Chip Microcomputer
• Manufacturer: SONY [Sony Corporation]

Package Outline
Unit: mm
52
64
SONY CODE
EIAJ CODE
JEDEC CODE
SONY CODE
JEDEC CODE
EIAJ CODE
1
64
1
51
1.0
SDIP064-P-0750
SDIP-64P-01
23.9 ± 0.4
20.0 – 0.1
QFP064-P-1420
QFP-64P-L01
57.6 – 0.1
+ 0.4
+ 0.4
64PIN QFP(PLASTIC)
64PIN SDIP (PLASTIC)
0.4 – 0.1
+ 0.15
0.9 ± 0.15
– 22 –
0.5 ± 0.1
33
19
1.778
PACKAGE MATERIAL
PACKAGE STRUCTURE
LEAD MATERIAL
PACKAGE MASS
LEAD TREATMENT
PACKAGE STRUCTURE
32
20
PACKAGE MATERIAL
PACKAGE MASS
LEAD TREATMENT
LEAD MATERIAL
33
0.2
32
2.75 – 0.15
M
+ 0.35
0° to10°
42/COPPER ALLOY
1.5g
EPOXY RESIN
SOLDER/PALLADIUM
0.1 – 0.05
EPOXY RESIN
SOLDER PLATING
42 ALLOY
8.6g
0.15 – 0.05
PLATING
+ 0.2
+ 0.1
0.15
0° to 15°
CXP86608/86612/86616