EMIF01-1003M3_10 STMICROELECTRONICS [STMicroelectronics], EMIF01-1003M3_10 Datasheet - Page 9

• Manufacturer Part Number: EMIF01-1003M3_10
• Manufacturer: STMICROELECTRONICS [STMicroelectronics]

EMIF01-1003M3
5.3
5.4
5.5
Note:
Placement
1.
2.
3.
4.
5.
6.
PCB design preference
1.
2.
Reflow profile
Figure 14. ST ECOPACK® recommended soldering reflow profile for PCB mounting
Minimize air convection currents in the reflow oven to avoid component movement.
Manual positioning is not recommended.
It is recommended to use the lead recognition capabilities of the placement system, not
the outline centering
Standard tolerance of ± 0.05 mm is recommended.
3.5 N placement force is recommended. Too much placement force can lead to
squeezed out solder paste and cause solder joints to short. Too low placement force
can lead to insufficient contact between package and solder paste that could cause
open solder joints or badly centered packages.
To improve the package placement accuracy, a bottom side optical control should be
performed with a high resolution tool.
For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is
recommended during solder paste printing, pick and place and reflow soldering by
using optimized tools.
To control the solder paste amount, the closed via is recommended instead of open
vias.
The position of tracks and open vias in the solder area should be well balanced. The
symmetrical layout is recommended, in case any tilt phenomena caused by
asymmetrical solder paste amount due to the solder flow away.
Temperature (°C)
Temperature (°C)
260°C max
260°C max
255°C
255°C
125 °C
125 °C
220°C
220°C
180°C
180°C
0
0
0
0
3°C/s max
3°C/s max
1
1
Doc ID 13976 Rev 2
90 to 150 sec
90 to 150 sec
2
2
3
3
4
4
90 sec max
90 sec max
10-30 sec
10-30 sec
Recommendation on PCB assembly
5
5
2°C/s recommended
6
6
6°C/s max
2°C/s recommended
6°C/s max
Time (min)
Time (min)
7
7
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