EMIF02-MIC02F2_11 STMICROELECTRONICS [STMicroelectronics], EMIF02-MIC02F2_11 Datasheet
EMIF02-MIC02F2_11
Related parts for EMIF02-MIC02F2_11
EMIF02-MIC02F2_11 Summary of contents
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... Mobile phones and communication systems ■ Computers, printers and MCU Boards Description The EMIF02-MIC02 is a highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference. The EMIF02 Flip-Chip packaging means the package size is equal to the die size. This filter includes an ESD protection circuitry which prevents damage to the application when subjected to ESD surges ...
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Electrical characteristics Table 1. Absolute ratings (T Symbol T junction temperature j T Operating temperature range op T Storage temperature range stg Table 2. Electrical characteristics (T Symbol V Breakdown voltage BR I Leakage current @ ...
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Figure 3. Attenuation measurement and Aplac simulation S21 (dB) - 10.00 - 15.00 - 20.00 - 25.00 - 30.00 - 35.00 - 40.00 - 45.00 F (Hz) - 50.00 1.0M 3.0M 10.0M 30.0M 100.0M 300.0M Figure 5. Digital crosstalk measurement ...
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Application information Figure 9. Aplac model I1 MODEL = D01-int Cox MODEL = D01-ext Rsubump Rsubump MODEL = D01-ext Cox MODEL = D01-int I2 Figure 10. Aplac parameters Model D01-ext CJO = Cz_ext IBV = 1u ...
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Ordering information scheme Figure 11. Ordering information scheme EMI Filter Number of lines Information x = resistance value (Ohms capacitance value / letters = application 2 digits = version Package F = Flip ...
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... All dimensions Ordering information Table 3. Ordering information Order code EMIF02-MIC02F2 Note: More information is available in the application notes: AN1235:"Flip Chip: Package description and recommendations for use" AN1751: “EMI filters: Recommendations and measurements” 6/8 Figure 14. Marking Dot, ST logo xx = marking ...
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Revision history Table 4. Document revision history Date Revision 12-Oct-2004 11-Jan-2006 17-Apr-2008 26-May-2011 1 Initial release. ECOPACK statement added. Die dimensions modified in 2 and first page. Typographical errors corrected. Updated ECOPACK statement. Updated 3 Figure 15. Reformatted to ...
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Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any ...