EMIF02-MIC02F2_11 STMICROELECTRONICS [STMicroelectronics], EMIF02-MIC02F2_11 Datasheet - Page 6

• Manufacturer Part Number: EMIF02-MIC02F2_11
• Manufacturer: STMICROELECTRONICS [STMicroelectronics]

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Note:
6/8
Figure 13. Footprint
340 µm min for 300 µm copper pad diameter
Solder mask opening recommendation:
250 µm recommended, 300 µm max
Solder stencil opening: 330 µm
Figure 15. Flip Chip tape and reel specification
Ordering information
Table 3.
More information is available in the application notes:
AN1235:"Flip Chip: Package description and recommendations for use"
AN1751: “EMI filters: Recommendations and measurements”
EMIF02-MIC02F2
All dimensions in mm
Copper pad Diameter:
Dot identifying Pin A1 location
Order code
0.20 ± 0.02
0.73 ± 0.05
Ordering information
Marking
FJ
2.0 ± 0.05
Doc ID 10913 Rev 4
Package
Flip Chip
1.02 ± 0.05
User direction of unreeling
Figure 14. Marking
Dot, ST logo
xx = marking
z = manufacturing location
yww = datecode
4.0 ± 0.1
(y = year
ww = week)
Weight
2.3 mg
4.0 ± 0.1
Ø 1.55 ± 0.05
Base qty
5000
x
y
w
x
Tape and reel 7”
Delivery mode
w
E
z