EMIF06-1502M12_08 STMICROELECTRONICS [STMicroelectronics], EMIF06-1502M12_08 Datasheet - Page 4

• Manufacturer Part Number: EMIF06-1502M12_08
• Manufacturer: STMICROELECTRONICS [STMicroelectronics]

Package information
3
4/10
Package information
●
In order to meet environmental requirements, ST offers these devices in ECOPACK
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the inner box label, in compliance with JEDEC
Standard JESD97. The maximum ratings related to soldering conditions are also marked on
the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at
www.st.com.
Table 3.
Figure 9.
0.40
Epoxy meets UL94, V0
E2
A
A1
0.40
QFN 2.5 x 1.5 package dimensions
Footprint
N
N
1
1
2
2
1.80
D2
e
D
b
0.20
0.60
0.25
E
L
k
2.10
Figure 10. Marking
Ref
D2
A1
E2
A
D
E
b
e
L
k
Dot: Pin 1
Identification
X = Marking
YWW= Data code
0.50
0.00
0.15
1.70
0.30
0.20
0.25
MIN
Millimeters
(Y=year
WW= week
TYP
0.55
0.02
0.18
2.50
1.80
1.50
0.40
0.40
0.30
Dimensions
MAX
0.60
0.05
0.25
1.90
0.50
0.35
EMIF06-1502M12
0.20
0.00
0.06
0.67
0.12
0.08
0.10
MIN
ww
ww
XY
XY
inches
TYP
0.22
0.01
0.07
0.98
0.71
0.59
0.16
0.16
0.12
®
MAX
0.24
0.02
0.10
0.75
0.24
0.14