EMIF06-MSD04F3_11 STMICROELECTRONICS [STMicroelectronics], EMIF06-MSD04F3_11 Datasheet - Page 7

• Manufacturer Part Number: EMIF06-MSD04F3_11
• Manufacturer: STMICROELECTRONICS [STMicroelectronics]

EMIF06-MSD04F3
4
Package information
●
●
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
Figure 12. Package dimensions
Figure 13. Footprint
Solder stencil opening:
Copper pad Diameter:
260 µm maximum
Solder mask opening:
300 µm minimum
220 µm recommended
220 µm recommended
Epoxy meets UL94, V0
Lead-free package
®
®
packages, depending on their level of environmental compliance. ECOPACK
is an ST trademark.
1.54 mm ± 40 µm
Doc ID 018849 Rev 1
400 µm ± 40
255 µm ± 40
170 µm ± 10
Figure 14. Marking
Dot, ST logo
xx = marking
z = manufacturing
yww = datecode
ECOPACK status
location
y = year,
ww = week
Package information
605 µm ± 55
x
y
w
x
w
z
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®