EMIF06-MSDN16 STMICROELECTRONICS [STMicroelectronics], EMIF06-MSDN16 Datasheet - Page 11

• Manufacturer Part Number: EMIF06-MSDN16
• Manufacturer: STMICROELECTRONICS [STMicroelectronics]

EMIF06-MSD02N16
5.5
Note:
6
7
Reflow profile
Figure 18. ST ECOPACK® recommended soldering reflow profile for PCB mounting
Minimize air convection currents in the reflow oven to avoid component movement.
Ordering information
Table 4.
1. The marking can be rotated by 90° to differentiate assembly location
Revision history
Table 5.
EMIF06-MSDN16
21-Nov-2008
Order code
Date
Temperature (°C)
Temperature (°C)
260°C max
260°C max
255°C
255°C
125 °C
125 °C
220°C
220°C
180°C
180°C
Ordering information
Document revision history
0
0
0
0
3°C/s max
3°C/s max
Revision
Marking
N6
1
1
1
(1)
Initial release.
90 to 150 sec
90 to 150 sec
Micro QFN
2
2
Package
3
3
6.17 mg
Weight
4
4
90 sec max
90 sec max
10-30 sec
10-30 sec
Changes
5
5
Base qty
3000
2°C/s recommended
6
6
Ordering information
6°C/s max
2°C/s recommended
6°C/s max
Time (min)
Time (min)
Tape and reel (7”)
Delivery mode
7
7
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