EMIF06-MSDN16 STMICROELECTRONICS [STMicroelectronics], EMIF06-MSDN16 Datasheet - Page 9

• Manufacturer Part Number: EMIF06-MSDN16
• Manufacturer: STMICROELECTRONICS [STMicroelectronics]

EMIF06-MSD02N16
5
5.1
Recommendation on PCB assembly
Stencil opening design
1.
Figure 16. Stencil opening dimensions
2.
Figure 17. Recommended stencil window position
General recommendation on stencil opening design
a)
b)
Reference design
a)
b)
c)
Stencil opening dimensions: L (Length), W (Width), T (Thickness).
General design rule
Stencil thickness (T) = 75 ~ 125 µm
Stencil opening thickness: 100 µm
Stencil opening for central exposed pad: Opening to footprint ratio is 50%.
Stencil opening for leads: Opening to footprint ratio is 90%.
300 µm
Aspect Ratio
Aspect Area
350 µm
5 µm
190 µm
200 µm
=
=
2800 µm
2100 µm
W
---- -
--------------------------- -
2T L
T
5 µm
L
≥
(
×
1.5
+
W
15 µm
15 µm
W
)
L
≥
350 µm
0.66
T
1.6
50 µm
50 µm
W
0.70
Recommendation on PCB assembly
0.40
Footprint
Stencil window
Footprint
3.00
2.30
0.20
0.45
0.30
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