AS4LC4M16DG-5S/IT AUSTIN [Austin Semiconductor], AS4LC4M16DG-5S/IT Datasheet - Page 6

• Manufacturer Part Number: AS4LC4M16DG-5S/IT
• Description: 4 MEG x 16 DRAM
• Manufacturer: AUSTIN [Austin Semiconductor]

EDO PAGE MODE (Continued)
two methods to disable the outputs and keep them disabled
during the CAS\ HIGH time. The first method is to have OE\
HIGH when CAS\ transitions HIGH and keep OE\ HIGH for
tOEHC thereafter. This will disable the DQs, and they will
remain disabled (regardless of the state of OE\ after that point)
until CAS\ falls again. The second method is to have OE\ LOW
when CAS\ transitions HIGH and then bring OE\ HIGH for a
minimum of t
will disable the DQs, and they will remain disabled (regardless
of the state of OE\ after that point) until CAS\ falls again (see
Figure 3). During other cycles, the outputs are disabled at t
time after RAS\ and CAS\ are HIGH or at t
transitions LOW. The t
edge of RAS\ or CAS\, whichever occurs last. WE\ can also
perform the function of disabling the output drivers under
certain conditions, as shown in Figure 4.
row address strobed in by the RAS\ signal, followed by a
column address strobed in by CAS\, just like for single location
accesses. However, subsequent column locations within the
row may then be accessed at the page mode cycle time. This is
accomplished by cycling CAS\ while holding RAS\ LOW and
entering new column addresses with each CAS\ cycle.
Returning RAS\ HIGH terminates the EDO-PAGE-MODE
operation.
DRAM REFRESH
levels, and the refresh requirements must be met in order to
AS4LC4M16
Rev. 1.0 7/02
EDO-PAGE-MODE operations are always initiated with a
The supply voltage must be maintained at the specified
OEP
anytime during the CAS\ HIGH period. This
Austin Semiconductor, Inc.
OFF
time is referenced from the rising
WHZ
after WE\
OFF
6
retain stored data in the DRAM. The refresh requirements are
met by refreshing all rows in the 4 Meg x 16 DRAM array at
least once every 64ms* (4,096 rows). The recommended
procedure is to execute 4,096 CBR REFRESH cycles, either
uniformly spaced or grouped in bursts, every 64ms*. The
DRAM refreshes one row for every CBR cycle. For this device,
executing 4,096 CBR cycles will refresh the entire device. The
CBR REFRESH will invoke the internal refresh counter for auto-
matic RAS\ addressing. Alternatively, RAS\-ONLY
FRESH capability is inherently provided. However, with this
method, only one row is refreshed on each cycle. JEDEC
strongly recommends the use of CBR REFRESH for this device.
version. The self refresh feature is initiated by performing a
CBR Refresh cycle and holding RAS\ low for the specified t
The “S” option allows the user the choice of a fully static,
low-power data retention mode or a dynamic refresh mode at
the extended refresh period of 128ms, or 31.25µs per cycle, when
using a distributed CBR refresh. This refresh rate can be
applied during normal operation, as well as during a standby or
battery backup mode.
for a minimum time of t
of any internal refresh cycles that may be in process at the time
of the RAS\ LOW-to-HIGH transition. If the DRAM controller
uses a distributed CBR refresh sequence, a burst refresh is not
required upon exiting self refresh, however, if the controller is
using RAS\ only or burst CBR refresh then a burst refresh
using t
NOTES:
*64ms for IT version, 32ms for XT version.
An optional self refresh mode is also available on the “S”
The self refresh mode is terminated by driving RAS\ HIGH
RC
(MIN) is required.
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
RPS
. This delay allows for the completion
AS4LC4M16
DRAM
DRAM
DRAM
DRAM
DRAM
RASS
RE-
.