IP4064CX8/LF/P NXP [NXP Semiconductors], IP4064CX8/LF/P Datasheet
IP4064CX8/LF/P
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IP4064CX8/LF/P Summary of contents
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IP4064CX8; IP4364CX8; IP4366CX8 Integrated SIM card passive filter array with ESD protection to IEC 61000-4-2 level 4 Rev. 02 — 11 February 2010 1. Product profile 1.1 General description The IP4064CX8, IP4364CX8 and IP4366CX8 are 3-channel RC low-pass filter arrays ...
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... All information provided in this document is subject to legal disclaimers. Rev. 02 — 11 February 2010 008aaa206 transparent top view, solder balls facing down Version IP4064CX8/LF/P IP4364CX8/LF/P IP4366CX8/P © NXP B.V. 2010. All rights reserved ...
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NXP Semiconductors 4. Functional diagram Fig 2. 5. Limiting values Table 3. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol ESD tot T stg T reflow(peak) T amb Device is qualified ...
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NXP Semiconductors 6. Characteristics Table amb Symbol Parameter R s(ch [1] Guaranteed by design. 7. Application information 7.1 Application diagram A typical application diagram showing IP4064CX8, IP4364CX8 or IP4366CX8 in ...
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NXP Semiconductors 7.2 Insertion loss The IP4064CX8, IP4364CX8 and IP4366CX8 are mainly designed as an EMI/RFI filter for SIM card interfaces. The insertion loss measurement configuration of a typical 50 Ω NetWork Analyzer (NWA) system for evaluation of the IP4064CX8, ...
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NXP Semiconductors 7.3 Crosstalk The crosstalk measurement configuration of a typical 50 Ω NWA system for evaluation of the IP4064CX8, IP4364CX8 and IP4366CX8 is shown in Four typical examples of crosstalk measurement results of IP4064CX8 and IP4364CX8 are depicted in ...
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NXP Semiconductors 8. Package outline WLCSP8: wafer level chip-size package; 8 bumps ( A1) bump A1 index area European projection Fig 8. Package outline (WLCSP8) IP4064CX8_IP4364CX8_IP4366CX8_2 Product data sheet IP4064CX8; IP4364CX8; IP4366CX8 ...
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NXP Semiconductors Table 5. Symbol IP4064CX8 IP4364CX8 and IP4366CX8 IP4064CX8_IP4364CX8_IP4366CX8_2 Product data sheet IP4064CX8; IP4364CX8; IP4366CX8 Integrated SIM ...
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NXP Semiconductors 9. Soldering of WLCSP packages 9.1 Introduction to soldering WLCSP packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering WLCSP (Wafer Level Chip-Size Packages) can be found in application ...
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NXP Semiconductors Fig 9. For further information on temperature profiles, refer to application note AN10365 “Surface mount reflow soldering description”. 9.3.1 Stand off The stand off between the substrate and the chip is determined by: • The amount of printed ...
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NXP Semiconductors Device removal can be done when the substrate is heated until it is certain that all solder joints are molten. The chip can then be carefully removed from the substrate without damaging the tracks and solder lands on ...
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NXP Semiconductors 12. Legal information 12.1 Data sheet status [1][2] Document status Product status Objective [short] data sheet Development Preliminary [short] data sheet Qualification Product [short] data sheet Production [1] Please consult the most recently issued document before initiating or ...
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NXP Semiconductors product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors ...
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NXP Semiconductors 14. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . ...