UBA2211APN1 NXP [NXP Semiconductors], UBA2211APN1 Datasheet - Page 14

• Manufacturer Part Number: UBA2211APN1
• Description: Half-bridge power IC family for CFL lamps
• Manufacturer: NXP [NXP Semiconductors]

NXP Semiconductors
12. Package outline
Fig 8.
UBA2211
Objective data sheet
DIP8: plastic dual in-line package; 8 leads (300 mil)
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
inches
UNIT
mm
Package outline SOT97-1 (DIP8)
OUTLINE
VERSION
SOT97-1
max.
0.17
4.2
A
min.
0.02
0.51
A
1
L
050G01
max.
0.13
3.2
A
IEC
Z
2
8
1
pin 1 index
0.068
0.045
1.73
1.14
b
b
D
e
0.021
0.015
0.53
0.38
b
1
All information provided in this document is subject to legal disclaimers.
MO-001
JEDEC
0.042
0.035
1.07
0.89
4
5
b
b
REFERENCES
1
2
0
Rev. 2 — 3 January 2011
A
b
0.014
0.009
1
0.36
0.23
2
w
c
A
E
M
2
SC-504-8
JEITA
scale
D
0.39
0.36
A
9.8
9.2
5
(1)
6.48
6.20
0.26
0.24
E
(1)
10 mm
2.54
Half-bridge power IC family for CFL lamps
0.1
e
7.62
0.3
e
c
1
3.60
3.05
0.14
0.12
(e )
M
L
M
PROJECTION
H
EUROPEAN
1
E
8.25
7.80
0.32
0.31
M
E
10.0
0.39
0.33
M
8.3
UBA2211
H
© NXP B.V. 2011. All rights reserved.
ISSUE DATE
0.254
0.01
99-12-27
03-02-13
w
SOT97-1
0.045
max.
1.15
Z
(1)
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