8533AGI-31LF IDT, 8533AGI-31LF Datasheet - Page 12

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8533AGI-31LF

Manufacturer Part Number
8533AGI-31LF
Description
Clock Drivers & Distribution
Manufacturer
IDT
Datasheet

Specifications of 8533AGI-31LF

Product Category
Clock Drivers & Distribution
Rohs
yes
Part # Aliases
ICS8533AGI-31LF
This section provides information on power dissipation and junction temperature for the ICS8533I-01.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS8533I-01 is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for V
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of
the device. The maximum recommended junction temperature for HiPerClockS
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
a moderate air flow of 200 linear feet per minute and a multi-layer board, the appropriate value is 66.6°C/W per Table 6 below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow,
and the type of board (single layer or multi-layer).
T
8533AGI-01
ABLE
Single-Layer PCB, JEDEC Standard Test Boards
Multi-Layer PCB, JEDEC Standard Test Boards
NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.
6. T
Power (core)
Power (outputs)
If all outputs are loaded, the total power is 4 * 30mW = 120mW
Total Power
The equation for Tj is as follows: Tj =
Tj = Junction Temperature
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
T
85°C + 0.300W * 66.6°C/W = 105°C. This is well below the limit of 125°C.
JA
A
HERMAL
= Ambient Temperature
= Junction-to-Ambient Thermal Resistance
R
MAX
ESISTANCE
_MAX
MAX
= V
(3.465V, with all outputs switching) = 180.2mW + 120mW = 300.2mW
= 30mW/Loaded Output pair
CC_MAX
JA
* I
FOR
EE_MAX
JA
20-
P
CC
by Velocity (Linear Feet per Minute)
= 3.465V * 52mA = 180.2mW
PIN
OWER
= 3.3V + 5% = 3.465V, which gives worst case results.
TSSOP, F
JA
* Pd_total + T
C
D
IFFERENTIAL
ORCED
ONSIDERATIONS
12
A
114.5°C/W
C
73.2°C/W
ONVECTION
0
-
TO
TM
-3.3V LVPECL F
devices is 125°C.
98.0°C/W
66.6°C/W
200
JA
ICS8533I-01
L
must be used. Assuming
OW
88.0°C/W
63.5°C/W
500
ANOUT
S
REV. A DECEMBER 6, 2007
KEW
, 1-
B
UFFER
TO
-4

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