SSTUH32865ET/G,551 NXP Semiconductors, SSTUH32865ET/G,551 Datasheet - Page 2

• Manufacturer Part Number: SSTUH32865ET/G,551
• Description: IC REG BUFFER 28-BIT 160TFBGA
• Manufacturer: NXP Semiconductors

Specifications of SSTUH32865ET/G,551

• Logic Type: 1:2 Registered Buffer with Parity
• Supply Voltage: 1.7 V ~ 1.9 V
• Number Of Bits: 28
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 160-TFBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 568-3578; 935277963551; SSTUH32865ET/G-S

Philips Semiconductors
3. Applications
4. Ordering information
Table 1:
9397 750 14136
Product data sheet
Type number
SSTUH32865ET/G Pb-free (SnAgCu solder ball
SSTUH32865ET
Ordering information
Solder process
compound)
SnPb solder ball compound
Supports Low Voltage Complementary Metal Oxide Silicon (LVCMOS) switching levels
on the control and RESET inputs
Single 1.8 V supply operation
Available in 160-ball 9 mm
High-density (for example, 2 rank by 4) DDR2 registered DIMMs
DDR2 Registered DIMMs (RDIMM) desiring parity checking functionality
Stacked or planar high-DRAM count registered DIMMs
Rev. 01 — 11 March 2005
Package
Name
TFBGA160
TFBGA160
1.8 V high output drive DDR registered buffer with parity
13 mm, 0.65 mm ball pitch TFBGA package
Description
plastic thin fine-pitch ball grid array package;
160 balls; body 9
plastic thin fine-pitch ball grid array package;
160 balls; body 9
13
13
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
0.8 mm
0.8 mm
SSTUH32865
Version
SOT802-1
SOT802-1
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