MAX1090BEEI Maxim Integrated, MAX1090BEEI Datasheet - Page 2

• Manufacturer Part Number: MAX1090BEEI
• Description: Analog to Digital Converters - ADC
• Manufacturer: Maxim Integrated

Specifications of MAX1090BEEI

• Number Of Channels: 8/4
• Architecture: SAR
• Conversion Rate: 400 KSPs
• Resolution: 10 bit
• Input Type: Single-Ended/Pseudo-Differential
• Snr: Yes
• Interface Type: Parallel
• Operating Supply Voltage: 2.7 V to 5.5 V, 5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Package / Case: QSOP-28
• Maximum Power Dissipation: 667 mW
• Minimum Operating Temperature: - 40 C
• Number Of Converters: 1
• Voltage Reference: Internal 2.5 V or External

ABSOLUTE MAXIMUM RATINGS
V
V
CH0–CH7, COM to GND ............................-0.3V to (V
REF, REFADJ to GND.................................-0.3V to (V
Digital Inputs to GND ...............................................-0.3V to +6V
Digital Outputs (D0–D9, INT)
400ksps, +5V, 8-/4-Channel, 10-Bit ADCs
with +2.5V Reference and Parallel Interface
ELECTRICAL CHARACTERISTICS
(V
cycle), T
2
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
DC ACCURACY (Note 1)
DYNAMIC SPECIFICATIONS (f
CONVERSION RATE
DD
LOGIC
Resolution
Relative Accuracy (Note 2)
Differential Nonlinearity
Offset Error
Gain Error (Note 3)
Gain Temperature Coefficient
Channel-to-Channel Offset
Matching
Signal-to-Noise Plus Distortion
Total Harmonic Distortion
(including 5th-order harmonic)
Spurious-Free Dynamic Range
Intermodulation Distortion
Channel-to-Channel Crosstalk
Full-Linear Bandwidth
Full-Power Bandwidth
Conversion Time (Note 5)
T/H Acquisition Time
Aperture Delay
Aperture Jitter
External Clock Frequency
Duty Cycle
DD
to GND ........................................... -0.3V to (V
_______________________________________________________________________________________
to GND ..............................................................-0.3V to +6V
= V
to GND.........................................................-0.3V to +6V
A
LOGIC
PARAMETER
= T
MIN
= +5V ±10%, COM = GND, REFADJ = V
to T
MAX
, unless otherwise noted. Typical values are at T
IN(sine wave)
SYMBOL
SINAD
t
SFDR
CONV
t
RES
DNL
THD
f
IMD
ACQ
INL
CLK
= 50kHz, V
MAX109_A
MAX109_B
No missing codes over temperature
f
f
SINAD > 56dB
-3dB rolloff
External clock mode
External acquisition/internal clock mode
Internal acquisition/internal clock mode
External acquisition or external clock mode
External acquisition or external clock mode
Internal acquisition/internal clock mode
IN1
IN
LOGIC
= 175kHz, V
= 49kHz, f
DD
DD
+ 0.3V)
+ 0.3V)
+ 0.3V)
IN
DD
= 2.5V
, V
IN2
IN
CONDITIONS
REF
P-P
= 2.5V
= 52kHz
, 400ksps, external f
= +2.5V, 4.7µF capacitor at REF pin, f
Continuous Power Dissipation (T
Operating Temperature Ranges
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
P-P
24-Pin QSOP (derate 9.5mW/°C above +70°C).........762mW
28-Pin QSOP (derate 8.00mW/°C above +70°C).......667mW
MAX1090_C_ _/MAX1092_C_ _ ....................... 0°C to +70°C
MAX1090_E_ _/MAX1092_E_ _ .....................-40°C to +85°C
A
(Note 4)
= +25°C.)
CLK
= 7.6MHz, bipolar input mode)
MIN
2.1
2.5
3.2
0.1
10
30
A
= +70°C)
<200
±2.0
±0.1
TYP
<50
CLK
350
-72
-78
3.0
3.6
60
72
76
25
6
= 7.6MHz (50% duty
MAX
±0.5
400
3.5
7.6
±1
±1
±2
±2
70
4
ppm/°C
UNITS
MHz
MHz
LSB
LSB
LSB
LSB
LSB
Bits
kHz
dB
dB
dB
dB
dB
µs
ns
ns
ps
%