S9S12GN16F0MLF Freescale Semiconductor, S9S12GN16F0MLF Datasheet - Page 1287

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S9S12GN16F0MLF

Manufacturer Part Number
S9S12GN16F0MLF
Description
16-bit Microcontrollers - MCU 16-bit16k Flash 2k RAM
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of S9S12GN16F0MLF

Rohs
yes
Core
S12
Processor Series
MC9S12G
Data Bus Width
16 bit
Maximum Clock Frequency
25 MHz
Program Memory Size
16 KB
Data Ram Size
1024 B
On-chip Adc
Yes
Operating Supply Voltage
3.13 V to 5.5 V
Operating Temperature Range
- 40 C to + 85 C
Package / Case
TSSOP-20
Mounting Style
SMD/SMT
D.7
Bondpad Coordinates
Freescale Semiconductor
KGD Information
Die Pad
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
1
2
3
4
5
6
7
8
9
Bond Post
MC9S12G Family Reference Manual, Rev.1.23
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
1
2
3
4
5
6
7
8
9
Table D-1. Bondpad Coordinates
X Coordinate
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
Die Pad
-1707.5
-1506.5
Y Coordinate
-1472.06
-1472.06
Die Pad
-1054.5
-1196.5
-1347.5
1347.5
1223.5
1116.5
1009.5
-201.5
-311.5
-396.5
-483.5
-578.5
-683.5
-797.5
-921.5
902.5
795.5
688.5
603.5
496.5
241.5
136.5
-91.5
22.5
369
Function
RESET
VDDX1
VSSX1
VDDR
BKGD
PE[0]
VSS1
PE[1]
TEST
PB[0]
PB[1]
PB[2]
PA[0]
PA[1]
PA[2]
PA[3]
PA[4]
PA[5]
PA[6]
PA[7]
PJ[6]
PJ[5]
PJ[4]
PJ[0]
PJ[1]
PJ[2]
PJ[3]
Package and Die Information
1289

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