SSTU32865ET,557 NXP Semiconductors, SSTU32865ET,557 Datasheet - Page 26

• Manufacturer Part Number: SSTU32865ET,557
• Description: IC BUFFER 1.8V 28BIT SOT802-1
• Manufacturer: NXP Semiconductors

Specifications of SSTU32865ET,557

• Logic Type: 1:2 Registered Buffer with Parity
• Supply Voltage: 1.7 V ~ 1.9 V
• Number Of Bits: 28
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 160-TFBGA
• Logic Family: SSTU
• Logical Function: Reg Bfr W/ParityTst
• Number Of Elements: 1
• Number Of Inputs: 28
• Number Of Outputs: 56
• High Level Output Current: -8mA
• Low Level Output Current: 8mA
• Propagation Delay Time: 3ns
• Operating Supply Voltage (typ): 1.8V
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Clock-edge Trigger Type: Posit/Negat-Edge
• Polarity: Non-Inverting
• Technology: CMOS
• Frequency (max): 450(Min)MHz
• Mounting: Surface Mount
• Pin Count: 160
• Operating Temp Range: 0C to 70C
• Operating Temperature Classification: Commercial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 935275069557; SSTU32865ET; SSTU32865ET

Philips Semiconductors
9397 750 13799
Product data sheet
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These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
Hot bar soldering or manual soldering is suitable for PMFP packages.
Rev. 02 — 28 September 2004
1.8 V DDR registered buffer with parity
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
SSTU32865
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