MCF51JF64VHS Freescale Semiconductor, MCF51JF64VHS Datasheet - Page 21

• Manufacturer Part Number: MCF51JF64VHS
• Description: 32-bit Microcontrollers - MCU COLDFIRE V1 64KFLASH
• Manufacturer: Freescale Semiconductor

Specifications of MCF51JF64VHS

• Rohs: yes
• Core: ColdFire V1
• Processor Series: MCF51JF128
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 50 MHz
• Program Memory Size: 64 KB
• On-chip Adc: Yes
• Operating Supply Voltage: 1.71 V to 3.6 V
• Operating Temperature Range: - 40 C to + 105 C
• Package / Case: QFN-44
• Mounting Style: SMD/SMT

5.4.2 Thermal attributes
1. Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions
2. Determined according to JEDEC Standard JESD51-8, Integrated Circuit Thermal Test Method Environmental Conditions
3. Determined according to Method 1012.1 of MIL-STD 883, Test Method Standard, Microcircuits, with the cold plate
4. Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions
6
6.1
6.1.1 Debug specifications
Freescale Semiconductor, Inc.
Single-layer
(1s)
Four-layer
(2s2p)
Single-layer
(1s)
Four-layer
(2s2p)
—
—
—
1
2
Board type
—Natural Convection (Still Air), or EIA/JEDEC Standard JESD51-6, Integrated Circuit Thermal Test Method
Environmental Conditions—Forced Convection (Moving Air).
—Junction-to-Board.
temperature used for the case temperature. The value includes the thermal resistance of the interface material between
the top of the package and the cold plate.
—Natural Convection (Still Air).
Number
Peripheral operating requirements and behaviors
Core modules
R
R
R
R
R
R
Ψ
Symbol
θJA
θJA
θJMA
θJMA
θJB
θJC
JT
t
t
MSSU
MSH
Symbol
Thermal resistance, junction to
ambient (natural convection)
Thermal resistance, junction to
ambient (natural convection)
Thermal resistance, junction to
ambient (200 ft./min. air speed)
Thermal resistance, junction to
ambient (200 ft./min. air speed)
Thermal resistance, junction to
board
Thermal resistance, junction to case 20
Thermal characterization
parameter, junction to package top
outside center (natural convection)
Table 12. Background debug mode (BDM) timing
Description
BKGD/MS setup time after issuing background
debug force reset to enter user mode or BDM
BKGD/MS hold time after issuing background
debug force reset to enter user mode or BDM
MCF51JF128 Data Sheet, Rev. 6, 01/2012.
Description
73
54
61
48
37
5.0
64 LQFP 48 LQFP
Peripheral operating requirements and behaviors
79
55
66
48
34
20
4.0
1
108
69
91
63
44
31
6.0
Laminate
500
100
QFN
44
Min.
98
33
81
28
13
2.2
6.0
32 QFN
—
—
Max.
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
ns
µs
Unit
1
1
1
1
2
3
4
Notes
21