LPC1317FHN33,551 NXP Semiconductors, LPC1317FHN33,551 Datasheet - Page 69

• Manufacturer Part Number: LPC1317FHN33,551
• Description: ARM Microcontrollers - MCU 32bit ARM Cortex-M3 64KB Flash 10KB SRAM
• Manufacturer: NXP Semiconductors

Specifications of LPC1317FHN33,551

• Rohs: yes
• Core: ARM Cortex M3
• Processor Series: LPC1317
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 72 MHz
• Program Memory Size: 64 KB
• Data Ram Size: 8 KB
• On-chip Adc: Yes
• Operating Supply Voltage: 2 V to 3.6 V
• Operating Temperature Range: - 40 C to + 85 C
• Package / Case: HVQFN-33
• Mounting Style: SMD/SMT
• Factory Pack Quantity: 260

NXP Semiconductors
14. Soldering
LPC1315_16_17_45_46_47
Product data sheet
Fig 37. Reflow soldering of the HVQFN33 package
Footprint information for reflow soldering of HVQFN33 package
solder land
solder paste deposit
occupied area
solder land plus solder paste
solder resist
Dimensions in mm
All information provided in this document is subject to legal disclaimers.
SPD = 1.00 SP
Rev. 3 — 20 September 2012
0.20 SR
chamfer (4×)
PID = 7.25 PA+OA
OwDtot = 5.10 OA
SDhtot = 2.70 SP
OID = 8.20 OA
DHS = 4.85 CU
LbD = 5.80 CU
LaD = 7.95 CU
evia = 4.25
evia = 2.40
4.55 SR
Remark:
Stencil thickness: 0.125 mm
GapD = 0.70 SP
LPC1315/16/17/45/46/47
e = 0.65
32-bit ARM Cortex-M3 microcontroller
W = 0.30 CU
0.45 DM
(A-side fully covered)
number of vias: 20
B-side
© NXP B.V. 2012. All rights reserved.
Solder resist
covered via
0.30 PH
0.60 SR cover
0.60 CU
001aao134
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