LPC11E14FBD64/401, NXP Semiconductors, LPC11E14FBD64/401, Datasheet - Page 54

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LPC11E14FBD64/401,

Manufacturer Part Number
LPC11E14FBD64/401,
Description
ARM Microcontrollers - MCU 32kB 4kB EE 10kB SRAM
Manufacturer
NXP Semiconductors
Datasheet

Specifications of LPC11E14FBD64/401,

Rohs
yes
Core
ARM Cortex M0
Processor Series
LPC11E1x
Data Bus Width
32 bit
Maximum Clock Frequency
50 MHz
Program Memory Size
32 KB
Data Ram Size
4 KB
On-chip Adc
Yes
Operating Supply Voltage
3.3 V
Operating Temperature Range
- 40 C to + 85 C
Package / Case
LQFP-64
Mounting Style
SMD/SMT
Factory Pack Quantity
160

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LPC11E14FBD64/401,
Manufacturer:
NXP Semiconductors
Quantity:
10 000
NXP Semiconductors
13. Soldering
LPC11E1X
Product data sheet
Fig 32. Reflow soldering for the HVQFN33 (7x7) package
Footprint information for reflow soldering of HVQFN33 package
solder land
solder paste deposit
occupied area
solder land plus solder paste
solder resist
Dimensions in mm
All information provided in this document is subject to legal disclaimers.
SPD = 1.00 SP
Rev. 1 — 20 February 2012
0.20 SR
chamfer (4×)
PID = 7.25 PA+OA
OwDtot = 5.10 OA
SDhtot = 2.70 SP
OID = 8.20 OA
DHS = 4.85 CU
LbD = 5.80 CU
LaD = 7.95 CU
evia = 4.25
evia = 2.40
4.55 SR
Remark:
Stencil thickness: 0.125 mm
GapD = 0.70 SP
e = 0.65
32-bit ARM Cortex-M0 microcontroller
W = 0.30 CU
0.45 DM
(A-side fully covered)
number of vias: 20
B-side
LPC11E1x
© NXP B.V. 2012. All rights reserved.
Solder resist
covered via
0.30 PH
0.60 SR cover
0.60 CU
001aao134
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