LPC11E11FHN33/101, NXP Semiconductors, LPC11E11FHN33/101, Datasheet - Page 54

• Manufacturer Part Number: LPC11E11FHN33/101,
• Description: ARM Microcontrollers - MCU 8kB 512B EE 4kB SRAM
• Manufacturer: NXP Semiconductors

Specifications of LPC11E11FHN33/101,

• Rohs: yes
• Core: ARM Cortex M0
• Processor Series: LPC11E1x
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 50 MHz
• Program Memory Size: 8 KB
• Data Ram Size: 512 B
• On-chip Adc: Yes
• Operating Supply Voltage: 3.3 V
• Operating Temperature Range: - 40 C to + 85 C
• Package / Case: HVQFN-33
• Mounting Style: SMD/SMT
• Factory Pack Quantity: 260

NXP Semiconductors
13. Soldering
LPC11E1X
Product data sheet
Fig 32. Reflow soldering for the HVQFN33 (7x7) package
Footprint information for reflow soldering of HVQFN33 package
solder land
solder paste deposit
occupied area
solder land plus solder paste
solder resist
Dimensions in mm
All information provided in this document is subject to legal disclaimers.
SPD = 1.00 SP
Rev. 1 — 20 February 2012
0.20 SR
chamfer (4×)
PID = 7.25 PA+OA
OwDtot = 5.10 OA
SDhtot = 2.70 SP
OID = 8.20 OA
DHS = 4.85 CU
LbD = 5.80 CU
LaD = 7.95 CU
evia = 4.25
evia = 2.40
4.55 SR
Remark:
Stencil thickness: 0.125 mm
GapD = 0.70 SP
e = 0.65
32-bit ARM Cortex-M0 microcontroller
W = 0.30 CU
0.45 DM
(A-side fully covered)
number of vias: 20
B-side
LPC11E1x
© NXP B.V. 2012. All rights reserved.
Solder resist
covered via
0.30 PH
0.60 SR cover
0.60 CU
001aao134
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