STM32F302VCT6 STMicroelectronics, STM32F302VCT6 Datasheet - Page 126
![no-image](/images/manufacturer_photos/0/6/637/stmicroelectronics_sml.jpg)
STM32F302VCT6
Manufacturer Part Number
STM32F302VCT6
Description
ARM Microcontrollers - MCU 32-Bit ARM Cortex M4 72MHz 256kB MCU FPU
Manufacturer
STMicroelectronics
Datasheet
1.STM32F302RBT6.pdf
(133 pages)
Specifications of STM32F302VCT6
Product Category
ARM Microcontrollers - MCU
Rohs
yes
Core
ARM Cortex M4
Data Bus Width
32 bit
Available stocks
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Quantity
Price
Company:
Part Number:
STM32F302VCT6
Manufacturer:
STMicroelectronics
Quantity:
500
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Package characteristics
7.2
7.2.1
126/133
Thermal characteristics
The maximum chip junction temperature (T
Table 22: General operating conditions on page
The maximum chip-junction temperature, T
using the following equation:
Where:
●
●
●
●
P
taking into account the actual V
application.
Table 79.
Reference document
JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural
Convection (Still Air). Available from www.jedec.org
I/O
Symbol
Θ
max represents the maximum power dissipation on output pins where:
T
Θ
P
P
internal power.
P
JA
A
D
INT
I/O
JA
max is the maximum ambient temperature in °C,
max is the sum of P
is the package junction-to-ambient thermal resistance, in °C/W,
max = Σ (V
max is the product of I
Thermal resistance junction-ambient
LQFP64 - 10 × 10 mm / 0.5 mm pitch
Thermal resistance junction-ambient
LQFP48 - 7 × 7 mm
Thermal resistance junction-ambient
LQFP100 - 14 × 14 mm / 0.5 mm pitch
Package thermal characteristics
OL
× I
OL
INT
T
) + Σ((V
Parameter
J
Doc ID 023353 Rev 5
max = T
OL
max and P
DD
/ I
and V
DD
OL
– V
A
and V
max + (P
DD
OH
I/O
J
J
, expressed in Watts. This is the maximum chip
max) must never exceed the values given in
max, in degrees Celsius, may be calculated
OH
) × I
max (P
58.
/ I
OH
D
OH
),
max x Θ
D
of the I/Os at low and high level in the
max = P
JA
STM32F302xx/STM32F303xx
)
INT
Value
45
55
41
max + P
I/O
max),
°C/W
Unit
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