MPC8536EAVTATLA Freescale Semiconductor, MPC8536EAVTATLA Datasheet - Page 112
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MPC8536EAVTATLA
Manufacturer Part Number
MPC8536EAVTATLA
Description
Microprocessors - MPU 8536 ENCRYPTED
Manufacturer
Freescale Semiconductor
Datasheet
1.MPC8548CVTAUJD.pdf
(126 pages)
Specifications of MPC8536EAVTATLA
Product Category
Microprocessors - MPU
Rohs
yes
Processor Series
PowerQUICC III
Core
e500
Data Bus Width
32 bit
Maximum Clock Frequency
250 MHz
Program Memory Size
32 KB
Data Ram Size
512 KB
Interface Type
I2C, USB
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
0 C to + 105 C
Mounting Style
SMD/SMT
Package / Case
MAPBGA-783
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Electrical Characteristics
The recommended attachment method to the heat sink is illustrated in the following figure. The heat sink should be attached to
the printed-circuit board with the spring force centered over the die. This spring force should not exceed 10 pounds force (45
Newton).
The system board designer can choose between several types of heat sinks to place on the chip. Ultimately, the final selection
of an appropriate heat sink depends on many factors, such as thermal performance at a given air velocity, spatial volume, mass,
attachment method, assembly, and cost. Several heat sinks offered by Aavid Thermalloy, Advanced Thermal Solutions, Alpha
Novatech, IERC, Chip Coolers, Millennium Electronics, and Wakefield Engineering offer different heat sink-to-ambient
thermal resistances, that will allow the chip to function in various environments.
2.24.3.1
For the packaging technology, shown in
This figure depicts the primary heat transfer path for a package with an attached heat sink mounted to a printed-circuit board.
112
•
•
The die junction-to-case thermal resistance
The die junction-to-board thermal resistance
Figure 73. Package Exploded Cross-Sectional View with Several Heat Sink Options
Internal Package Conduction Resistance
(Note the internal versus external package resistance)
External Resistance
External Resistance
MPC8535E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 5
Internal Resistance
Figure 74. Package with Heat Sink Mounted to a Printed-Circuit Board
Thermal Interface Material
Printed-Circuit Board
Printed-Circuit Board
Table
Heat Sink
Heat Sink
Heat Sink
70, the intrinsic internal conduction thermal resistance paths are as follows:
Clip
Die
Radiation
Radiation
Convection
Convection
FC-PBGA Package
Thermal Interface Material
Die/Package
Die Junction
Package/Solder Spheres
Freescale Semiconductor
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