74LVC16245AEV/G NXP Semiconductors, 74LVC16245AEV/G Datasheet - Page 2

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74LVC16245AEV/G

Manufacturer Part Number
74LVC16245AEV/G
Description
Bus Transceivers 3.3V XVER DIR PIN
Manufacturer
NXP Semiconductors
Datasheet

Specifications of 74LVC16245AEV/G

Product Category
Bus Transceivers
Rohs
yes
Logic Type
CMOS
Logic Family
LVC
Number Of Channels Per Chip
16
Input Level
LVTTL
Output Level
LVTTL
Output Type
3-State
High Level Output Current
- 24 mA
Low Level Output Current
24 mA
Propagation Delay Time
2.2 ns (Typ)
Supply Voltage - Max
3.6 V
Supply Voltage - Min
1.2 V
Maximum Operating Temperature
+ 125 C
Package / Case
VFBGA
Function
Bus Transceiver
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
Number Of Circuits
2
Polarity
Non-Inverting
Factory Pack Quantity
1820
Part # Aliases
74LVC16245AEV/G

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
74LVC16245AEV/G,51
Manufacturer:
NXP Semiconductors
Quantity:
10 000
Part Number:
74LVC16245AEV/G,55
Manufacturer:
NXP Semiconductors
Quantity:
10 000
Part Number:
74LVC16245AEV/G:55
Manufacturer:
NXP Semiconductors
Quantity:
10 000
NXP Semiconductors
3. Ordering information
Table 1.
4. Functional diagram
74LVC_LVCH16245A
Product data sheet
Type number
74LVC16245ADL
74LVCH16245ADL
74LVC16245ADGG
74LVCH16245ADGG
74LVC16245AEV
74LVCH16245AEV
74LVC16245ABX
74LVCH16245ABX
Fig 1.
Logic symbol
Ordering information
1DIR
Temperature range Package
40 C to +125 C
40 C to +125 C
40 C to +125 C
40 C to +125 C
1A0
1A1
1A2
1A3
1A4
1A5
1A6
1A7
All information provided in this document is subject to legal disclaimers.
Name
SSOP48
TSSOP48
VFBGA56
HXQFN60
Rev. 12 — 13 February 2012
74LVC16245A; 74LVCH16245A
16-bit bus transceiver with direction pin; 5 V tolerant; 3-state
1B0
1B1
1B2
1B3
1B4
1B5
1B6
1B7
1OE
Description
plastic shrink small outline package; 48 leads;
body width 7.5 mm
plastic thin shrink small outline package;
48 leads; body width 6.1 mm
plastic very thin fine-pitch ball grid array package;
56 balls; body 4.5  7  0.65 mm
plastic compatible thermal enhanced extremely
thin quad flat package; no leads; 60 terminals;
body 4  6  0.5 mm
2DIR
2A0
2A1
2A2
2A3
2A4
2A5
2A6
2A7
001aaa789
2OE
2B0
2B1
2B2
2B3
2B4
2B5
2B6
2B7
© NXP B.V. 2012. All rights reserved.
Version
SOT370-1
SOT362-1
SOT702-1
SOT1134-2
2 of 20

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