MAX5705AAUB+ Maxim Integrated, MAX5705AAUB+ Datasheet - Page 2

• Manufacturer Part Number: MAX5705AAUB+
• Description: Digital to Analog Converters - DAC 12Bit 1Ch V Buffered Precision DAC
• Manufacturer: Maxim Integrated

Specifications of MAX5705AAUB+

• Rohs: yes
• Number Of Converters: 1
• Number Of Dac Outputs: 1
• Resolution: 12 bit
• Interface Type: Serial SPI
• Settling Time: 6 us
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Package / Case: uMAX-10
• Maximum Power Dissipation: 707.3 mW
• Minimum Operating Temperature: - 40 C
• Output Type: Voltage Buffered
• Supply Current: 155 uA
• Supply Voltage - Max: 5.5 V
• Supply Voltage - Min: 2.7 V

ABSOLUTE MAXIMUM RATINgS
V
V
OUT, REF to GND ........-0.3V to lower of (V
CS, SCLK, DIN, AUX, LDAC to GND ......................-0.3V to +6V
Continuous Power Dissipation (T
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACkAgE THERMAL CHARACTERISTICS (Note 1)
TDFN
µMAX
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
ELECTRICAL CHARACTERISTICS
(V
(Note 2)
Maxim Integrated
Ultra-Small, Single-Channel, 8-/10-/12-Bit Buffered Output
DC PERFORMANCE (Note 3)
Resolution and Monotonicity
Integral Nonlinearity (Note 4)
Differential Nonlinearity (Note 4)
Offset Error (Note 5)
Offset Error Drift
Gain Error (Note 5)
Gain Temperature Coefficient
Zero-Scale Error
Full-Scale Error
DD
DDIO
Voltage DACs with Internal Reference and SPI Interface
Junction-to-Ambient Thermal Resistance (θ
DD
TDFN (derate 14.9mW/NC above +70NC) ...............1188.7mW
µMAX (derate 8.8mW/NC above +70NC) ..................707.3mW
Junction-to-Ambient Thermal Resistance (θ
Junction-to-Ambient Thermal Resistance (θ
to GND .............................................................-0.3V to +6V
= 2.7V to 5.5V, V
to GND .........................................................-0.3V to +6V
board. For detailed information on package thermal considerations, refer to www.maximintegated.com/thermal-tutorial.
PARAMETER
DDIO
= 1.8V to 5.5V, V
A
= +70NC)
SYMBOL
DNL
INL
OE
GE
N
DD
JC
JA
JA
+ 0.3V) and +6V
GND
) ...........36NC/W
) .......67.3NC/W
) .....113.1NC/W
MAX5703
MAX5704
MAX5705
MAX5703, 8 bits
MAX5704, 10 bits
MAX5705, 12 bits
MAX5703, 8 bits
MAX5704, 10 bits
MAX5705, 12 bits
With respect to V
With respect to V
= 0V, C
MAX5703/MAX5704/MAX5705
L
= 200pF, R
CONDITIONS
REF
REF
Maximum Continuous Current into Any Pin .................... ±50mA
Operating Temperature Range ........................ -40NC to +125NC
Storage Temperature Range ............................ -65NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
L
= 2kI , T A = -40NC to +125NC, unless otherwise noted.)
-0.25
-0.25
MIN
-0.5
-0.5
-1.0
-0.5
10
12
-1
-1
-5
8
0
±0.05
±0.05
±0. 5
±0.2
±0.1
±0.2
±0.5
±0.1
±2.5
TYP
±10
+0.25
+0.25
MAX
+0.5
+0.5
+1.0
+0.5
+10
+1
+1
+5
ppm of
UNITS
FV/NC
FS/NC
%FS
%FS
LSB
LSB
Bits
mV
mV
2