CAT24C04HU4I-GT3 ON Semiconductor, CAT24C04HU4I-GT3 Datasheet - Page 15

• Manufacturer Part Number: CAT24C04HU4I-GT3
• Description: EEPROM 4KB I2C SER EEPROM
• Manufacturer: ON Semiconductor

Specifications of CAT24C04HU4I-GT3

• Product Category: EEPROM
• Rohs: yes
• Memory Size: 4 Kbit
• Organization: 128 x 16
• Data Retention: 100 yr
• Maximum Clock Frequency: 400 KHz
• Maximum Operating Current: 1 mA, 2 mA
• Operating Supply Voltage: 1.8 V to 5.5 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Package / Case: UDFN-8
• Interface Type: I2C
• Minimum Operating Temperature: - 40 C

2X
2X
0.10
0.20
NOTE 5
0.05
L
T
T
H
1
5
A
2
G
4
3
C
B
*For additional information on our Pb−Free strategy and soldering
T
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
S
D
SEATING
PLANE
5X
0.20
C A B
0.039
PACKAGE DIMENSIONS
1.0
0.037
0.95
SOLDERING FOOTPRINT*
http://onsemi.com
CASE 483−02
J
K
ISSUE H
TSOP−5
15
DETAIL Z
0.074
1.9
0.028
0.7
DETAIL Z
M
SCALE 10:1
0.094
2.4
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES
4. DIMENSIONS A AND B DO NOT INCLUDE
5. OPTIONAL CONSTRUCTION: AN
ASME Y14.5M, 1994.
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
ADDITIONAL TRIMMED LEAD IS ALLOWED
IN THIS LOCATION. TRIMMED LEAD NOT TO
EXTEND MORE THAN 0.2 FROM BODY.
DIM
A
B
C
D
G
H
K
M
J
L
S
inches
mm
MILLIMETERS
MIN
0.90
0.25
0.01
0.10
0.20
1.25
2.50
3.00 BSC
1.50 BSC
0.95 BSC
0
_
MAX
1.10
0.50
0.10
0.26
0.60
1.55
10
3.00
_