CAT24C04HU4I-GT3 ON Semiconductor, CAT24C04HU4I-GT3 Datasheet - Page 18

• Manufacturer Part Number: CAT24C04HU4I-GT3
• Description: EEPROM 4KB I2C SER EEPROM
• Manufacturer: ON Semiconductor

Specifications of CAT24C04HU4I-GT3

• Product Category: EEPROM
• Rohs: yes
• Memory Size: 4 Kbit
• Organization: 128 x 16
• Data Retention: 100 yr
• Maximum Clock Frequency: 400 KHz
• Maximum Operating Current: 1 mA, 2 mA
• Operating Supply Voltage: 1.8 V to 5.5 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Package / Case: UDFN-8
• Interface Type: I2C
• Minimum Operating Temperature: - 40 C

NOTE 4
0.10
5X
2X
2X
NOTE 3
REFERENCE
REFERENCE
M
C
0.05 C
5X
PIN A1
PIN A1
A
0.10 C
0.10 C
0.10 C
B
b
BOTTOM VIEW
È È
C
B
A
SIDE VIEW
TOP VIEW
1
E
2
3
e
A1
A
A B
e1
A2
D
C
PACKAGE DIMENSIONS
SEATING
PLANE
WLCSP5, 0.86x0.84
http://onsemi.com
CASE 567DD
ISSUE C
18
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
NOTES:
PITCH
0.52
1. DIMENSIONING AND TOLERANCING PER ASME
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DATUM C, THE SEATING PLANE, IS DEFINED BY THE
4. COPLANARITY APPLIES TO SPHERICAL CROWNS
5. DIMENSION b IS MEASURED AT THE MAXIMUM CON-
SOLDERING FOOTPRINT*
Y14.5M, 1994.
SPHERICAL CROWNS OF THE CONTACT BALLS.
OF THE CONTACT BALLS.
TACT BALL DIAMETER PARALLEL TO DATUM C.
DIM
A1
A2
e1
A
D
b
E
e
RECOMMENDED
A1
MILLIMETERS
MIN
0.29
0.10
0.14
0.23 REF
0.86 BSC
0.84 BSC
0.30 BSC
0.52 BSC
DIMENSIONS: MILLIMETERS
MAX
0.39
0.14
0.18
0.30
PITCH
5X
PACKAGE
OUTLINE
0.16