AT24C08AN-10SU-1.8 Atmel, AT24C08AN-10SU-1.8 Datasheet - Page 15

no-image

AT24C08AN-10SU-1.8

Manufacturer Part Number
AT24C08AN-10SU-1.8
Description
EEPROM 8K 2-WIRE 1M CYCLES - 10MS 1.8V
Manufacturer
Atmel
Datasheet

Specifications of AT24C08AN-10SU-1.8

Product Category
EEPROM
Rohs
yes
Memory Size
8 Kbit
Organization
1024 K x 8
Data Retention
100 yr
Maximum Clock Frequency
0.1 MHz
Maximum Operating Current
3 mA
Operating Supply Voltage
2.5 V, 3.3 V, 5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Package / Case
SOIC
Access Time
4500 ns
Interface Type
2-Wire
Minimum Operating Temperature
- 40 C
Factory Pack Quantity
100
Supply Voltage - Max
5.5 V
Supply Voltage - Min
1.8 V

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
AT24C08AN-10SU-1.8
Manufacturer:
VISHAY
Quantity:
6 023
Part Number:
AT24C08AN-10SU-1.8
Manufacturer:
ATMEL/爱特梅尔
Quantity:
20 000
AT24C04 Ordering Information
Notes:
0180Z1–SEEPR–5/07
8P3
8S1
8A2
8Y1
8Y6
5TS1
8U3-1
–2.7
–1.8
Ordering Code
AT24C04-10PU-2.7
AT24C04-10PU-1.8
AT24C04N-10SU-2.7
AT24C04N-10SU-1.8
AT24C04-10TU-2.7
AT24C04-10TU-1.8
AT24C04Y1-10YU-1.8
AT24C04Y6-10YH-1.8
AT24C04-10TSU-1.8
AT24C04U3-10UU-1.8
AT24C04-W1.8-11
1. For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the AC and DC characteristics table.
2. “U” designates Green Package + RoHS compliant.
3. “H” designates Green Package + RoHS compliant, with NiPdAu Lead Finish.
4. Available in waffle pack and wafer form; order as SL788 for inkless wafer form. Bumped die available upon request. Please
contact Serial EEPROM Marketing.
8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)
8-lead, 4.90 mm x 3.00 mm Body, Dual Footprint, Non-leaded, Miniature Array Package (MAP)
8-lead, 2.00 x 3.00 mm Body, 0.50 mm Pitch, Ultra Thin Mini-MAP, Dual No Lead Package (DFN), (MLP 2x3 mm)
5-lead, 2.90 mm x 1.60 mm Body, Plastic Thin Shrink Small Outline Package (SOT23)
8-ball, die Ball Grid Away Package (dBGA2)
Low-voltage (2.7V to 5.5V)
Low-voltage (1.8V to 5.5V)
(4)
(2)
(2)
(2)
(2)
(2)
(2)
(2)
(2)
(3)
(2)
(Not recommended for new design)
(1)
Package Type
Options
Package
8P3
8P3
8S1
8S1
8A2
8A2
8Y1
8Y6
5TS1
8U3-1
Die Sale
Lead-free/Halogen-free/
Industrial Temperature
Industrial Temperature
Operation Range
(–40°C to 85°C)
(–40°C to 85°C)
15

Related parts for AT24C08AN-10SU-1.8