FT220XS-U FTDI, FT220XS-U Datasheet - Page 43

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FT220XS-U

Manufacturer Part Number
FT220XS-U
Description
USB Interface IC USB to 4 bit SPI / FT1248 IC SSOP-16
Manufacturer
FTDI
Datasheet

Specifications of FT220XS-U

Rohs
yes
Tradename
X-Chip
10.5 Solder Reflow Profile
The FT220X is supplied in Pb free 16 LD SSOP and QFN-16 packages. The recommended solder reflow
profile for both package options is shown in Figure 10.5.
Figure 10.5 FT220X Solder Reflow Profile
The recommended values for the solder reflow profile are detailed in Table 10.1. Values are shown for
both a completely Pb free solder process (i.e. the FT220X is used with Pb free solder), and for a non-Pb
free solder process (i.e. the FT220X is used with non-Pb free solder).
Table 10.1 Reflow Profile Parameter Values
Time Maintained Above Critical Temperature
Time within 5°C of actual Peak Temperature
25
Time for T= 25°C to Peak Temperature, T
T
T
p
L
T Max
T Min
S
S
Average Ramp Up Rate (T
- Temperature Max (T
- Temperature Min (T
- Time (t
Peak Temperature (T
- Temperature (T
Profile Feature
Ramp Down Rate
- Time (t
Preheat
s
Copyright © 2013 Future Technology Devices International Limited
Min to t
(t
T = 25º C to T
T
Preheat
Time, t (seconds)
L
p
:
)
t
S
L
)
s
Max)
s
s
L
)
Min.)
Max.)
P
s
p
)
to T
Ramp Up
p
)
p
FT220X USB 4-BIT SPI/FT1248 IC Datasheet
Pb Free Solder Process
3°C / second Max.
60 to 120 seconds
60 to 150 seconds
6°C / second Max.
20 to 40 seconds
8 minutes Max.
t
p
150°C
200°C
217°C
260°C
t
L
Document No.: FT_000629 Clearance No.: FTDI# 262
Ramp
Down
Critical Zone: when
T is in the range
T to T
L
Non-Pb Free Solder Process
p
3°C / Second Max.
60 to 120 seconds
60 to 150 seconds
6°C / second Max.
20 to 40 seconds
6 minutes Max.
100°C
150°C
183°C
240°C
Version 1.2
43

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