TJA1022T,118 NXP Semiconductors, TJA1022T,118 Datasheet - Page 20
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TJA1022T,118
Manufacturer Part Number
TJA1022T,118
Description
LIN Transceivers DUAL LIN 5-18V
Manufacturer
NXP Semiconductors
Datasheet
1.TJA1022T118.pdf
(26 pages)
Specifications of TJA1022T,118
Rohs
yes
Operating Supply Voltage
5 V to 18 V
Supply Current
10 mA
Package / Case
SO-14
Mounting Style
SMD/SMT
Factory Pack Quantity
2500
NXP Semiconductors
TJA1022
Product data sheet
16.4 Reflow soldering
Key characteristics in reflow soldering are:
Table 10.
Table 11.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Package thickness (mm)
< 2.5
2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
•
•
•
•
•
Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specifications, including temperature and impurities
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 10
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
and
Figure
All information provided in this document is subject to legal disclaimers.
11
9.
Rev. 1 — 30 March 2012
Package reflow temperature (C)
Volume (mm
< 350
235
220
Package reflow temperature (C)
Volume (mm
< 350
260
260
250
3
3
)
)
Figure
350 to 2000
260
250
245
Dual LIN 2.2/SAE J2602 transceiver
9) than a SnPb process, thus
350
220
220
> 2000
260
245
245
TJA1022
© NXP B.V. 2012. All rights reserved.
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