74AHCT125D-Q100,11 NXP Semiconductors, 74AHCT125D-Q100,11 Datasheet - Page 3

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74AHCT125D-Q100,11

Manufacturer Part Number
74AHCT125D-Q100,11
Description
Buffers & Line Drivers
Manufacturer
NXP Semiconductors
Datasheet

Specifications of 74AHCT125D-Q100,11

Rohs
yes
Number Of Input Lines
4
Number Of Output Lines
4
Polarity
Non-Inverting
Supply Voltage - Max
5.5 V
Supply Voltage - Min
4.5 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
Package / Case
SO-14
Logic Family
74AHCT
Logic Type
CMOS
Maximum Power Dissipation
500 mW
Minimum Operating Temperature
- 40 C
Output Type
3-State
Propagation Delay Time
11.5 ns
Supply Current
75 mA
NXP Semiconductors
5. Pinning information
Table 2.
6. Functional description
Table 3.
[1]
74AHC_AHCT125_Q100
Product data sheet
Symbol
1OE, 2OE, 3OE, 4OE
1A, 2A, 3A, 4A
1Y, 2Y, 3Y, 4Y
GND
V
Control
nOE
L
H
Fig 4.
CC
H = HIGH voltage level; L = LOW voltage level; X = don’t care; Z = high-impedance OFF-state.
Pin configuration SO14 and TSSOP14
Pin description
Function table
GND
1OE
2OE
1A
1Y
2A
2Y
5.1 Pinning
5.2 Pin description
1
2
3
4
5
6
7
74AHCT125-Q100
74AHC125-Q100
[1]
Pin
1, 4, 10, 13
2, 5, 9, 12
3, 6, 8, 11
7
14
aaa-003138
74AHC125-Q100; 74AHCT125-Q100
14
13
12
11
10
Input
nA
L
H
X
All information provided in this document is subject to legal disclaimers.
9
8
V
4OE
4A
4Y
3OE
3A
3Y
output enable input (active LOW)
data input
data output
ground (0 V)
Description
supply voltage
CC
Rev. 1 — 5 June 2012
Fig 5.
(1) This is not a supply pin. The substrate is attached to this
pad using conductive die attach material. There is no
electrical or mechanical requirement to solder this pad.
However, if it is soldered, the solder land should remain
floating or be connected to GND.
Pin configuration DHVQFN14
index area
terminal 1
2OE
1A
1Y
2A
2Y
Output
nY
L
H
Z
74AHCT125-Q100
Transparent top view
2
3
4
5
6
74AHC125-Q100
Quad buffer/line driver; 3-state
GND
(1)
13
12
11
10
9
aaa-003139
© NXP B.V. 2012. All rights reserved.
4OE
4A
4Y
3OE
3A
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