MAX9207EAI-T Maxim Integrated, MAX9207EAI-T Datasheet - Page 2

• Manufacturer Part Number: MAX9207EAI-T
• Description: LVDS Interface IC
• Manufacturer: Maxim Integrated

10-Bit Bus LVDS Serializers
ABSOLUTE MAXIMUM RATINGS
AVCC, DVCC to GND..........................……………-0.3V to +4.0V
IN_, SYNC1, SYNC2, EN, TCLK_R/F, TCLK,
OUT+, OUT- to GND .............................................-0.3V to +4.0V
Output Short-Circuit Duration.....................................Continuous
Continuous Power Dissipation (T
PACKAGE THERMAL CHARACTERISTICS (Note 1)
SSOP
MAX9205/MAX9207
2
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
DC ELECTRICAL CHARACTERISTICS
(V
V
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
DVCC
Junction-to-Ambient Thermal Resistance (θ
Junction-to-Case Thermal Resistance (θ
High-Level Input Voltage
Low-Level Input Voltage
Input Current
Differential Output Voltage
Change in V
Complementary Output States
Output Offset Voltage
Change in V
Complementary Output States
Output Short-Circuit Current
Output High-Impedance Current
Power-Off Output Current
POWER SUPPLY
Supply Current
Power-Down Supply Current
LVCMOS/LVTLL LOGIC INPUTS (IN0 TO IN9, EN, SYNC1, SYNC2, TCLK, TCLK_R/F, PWRDN)
BUS LVDS OUTPUTS (OUT+, OUT-)
AVCC
PWRDN to GND......................................-0.3V to (V
28-Pin SSOP (derate 9.5mW/°C above +70°C) ..........762mW
= +3.3V and T
= V
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
PARAMETER
DVCC
OD
OS
Between
Between
= +3.0V to +3.6V, R
A
= +25°C, unless otherwise noted.) (Notes 2, 3, 4)
A
= +70°C)
SYMBOL
L
∆V
∆V
I
V
V
JC
V
I
I
I
I
CCX
V
I
= 27Ω ±1% or 50Ω ±1%, C
OS
OZ
OX
CC
IN
OD
OS
IH
IL
OD
OS
)......................25°C/W
JA
)...............68°C/W
V
Figure 1
Figure 1
Figure 1
Figure 1
V
IN0 to IN9 = PWRDN = EN = high
V
V
V
R
worst-case pattern
(Figures 2, 4)
PWRDN = low
IN_
OUT+
PWRDN
OUT+
_VCC
L
CC
= 27_ or 50_
= 0V or V
+ 0.3V)
= 0V, V
or V
or V
or V
OUT-
OUT-
EN
_VCC
OUT+
CONDITIONS
= 0.8V,
= 0V,
= 0V or V
L
Storage Temperature Range .............................-65°C to +150°C
Junction Temperature ......................................................+150°C
Operating Temperature Range ...........................-40°C to +85°C
ESD Protection (Human Body Model, OUT+, OUT-) ...........±8kV
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
or V
= 10pF, T
MAX9205
MAX9207
R
R
L
L
OUT-
= 27Ω
= 50Ω
_VCC
= 0V or 3.6V
A
= -40°C to +85°C. Typical values are at V
16MHz
40MHz
40MHz
66MHz
GND
MIN
200
250
-20
-10
-10
2.0
0.9
TYP
1.15
286
460
-13
23
34
32
45
1
3
MAX
V
+20
400
600
+10
+10
0.8
1.3
-15
Maxim Integrated
35
35
35
45
50
60
CC
8
UNITS
AVCC
mV
mV
mV
mV
mA
mA
mA
µA
µA
µA
V
V
V
=