74HC74PW NXP Semiconductors, 74HC74PW Datasheet
74HC74PW
Specifications of 74HC74PW
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74HC74PW Summary of contents
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Dual D-type flip-flop with set and reset; positive edge-trigger Rev. 4 — 27 August 2012 1. General description The 74HC74 and 74HCT74 are dual positive edge triggered D-type flip-flop. They have individual data (nD), clock (nCP), set (nSD) ...
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... NXP Semiconductors Table 1. Ordering information Type number Package Temperature range 40 C to +125 C 74HC74PW 74HCT74PW 40 C to +125 C 74HC74BQ 74HCT74BQ 4. Functional diagram 4 10 1SD 2SD 1CP CP 11 2CP 1RD 2RD ...
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... NXP Semiconductors 5. Pinning information 5.1 Pinning +& +&7 &3 *1' Fig 5. Pin configuration for DIP14, SO14 and (T)SSOP14 5.2 Pin description Table 2. Pin description Symbol Pin Description 1RD 1 asynchronous reset-direct input (active LOW data input 1CP 3 clock input (LOW-to-HIGH, edge-triggered) ...
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... NXP Semiconductors 6. Functional description [1] Table 3. Function table Input nSD nRD [ HIGH voltage level LOW voltage level don’t care. [1] Table 4. Function table Input nSD nRD HIGH voltage level LOW voltage level; = LOW-to-HIGH transition don’ ...
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... NXP Semiconductors 8. Recommended operating conditions Table 6. Recommended operating conditions Voltages are referenced to GND (ground = 0 V) Symbol Parameter V supply voltage CC V input voltage I V output voltage O T ambient temperature amb t/V input transition rise and fall rate 9. Static characteristics Table 7. Static characteristics At recommended operating conditions ...
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... NXP Semiconductors Table 7. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions V HIGH-level output voltage = LOW-level output voltage input leakage current supply current ...
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... NXP Semiconductors 10. Dynamic characteristics Table 8. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); C Symbol Parameter Conditions 74HC74 t propagation nCP to nQ, nQ; see pd delay Figure nSD to nQ, nQ; see Figure nRD to nQ, nQ ...
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... NXP Semiconductors Table 8. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); C Symbol Parameter Conditions t set-up time nD to nCP; see hold time nD to nCP; see maximum nCP; see max frequency 4.5 V ...
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... NXP Semiconductors Table 8. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); C Symbol Parameter Conditions t hold time nD to nCP; see 4 maximum nCP; see max frequency power pF MHz dissipation V = GND capacitance [1] All typical values are measured at T ...
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... NXP Semiconductors 11. Waveforms Q' LQSXW Q&3 LQSXW Q4 RXWSXW Q4 RXWSXW Measurement points are given in V and V are typical voltage output levels that occur with the output load Fig 7. Input to output propagation delay, output transition time, clock input pulse width and maximum frequency ...
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... NXP Semiconductors nCP input nSD input nRD input nQ output nQ output Measurement points are given in V and V are typical voltage output levels that occur with the output load Fig 8. Set and reset propogation delays, pulse widths and recovery time Table 9. Measurement points ...
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... NXP Semiconductors Test data is given in Table Definitions test circuit Termination resistance should be equal to output impedance Load capacitance including jig and probe capacitance Load resistance Test selection switch. Fig 9. Test circuit for measuring switching times Table 10. Test data Type ...
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... NXP Semiconductors 12. Package outline DIP14: plastic dual in-line package; 14 leads (300 mil pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT max. min. max. mm 4.2 0.51 3.2 inches 0.17 0.02 0.13 Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. ...
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... NXP Semiconductors SO14: plastic small outline package; 14 leads; body width 3 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.25 1.45 mm 1.75 0.25 0.10 1.25 0.010 0.057 inches 0.069 0.01 0.004 0.049 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...
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... NXP Semiconductors SSOP14: plastic shrink small outline package; 14 leads; body width 5 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT max. 0.21 1. 0.25 0.05 1.65 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION IEC SOT337-1 Fig 12 ...
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... NXP Semiconductors TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT max. 0.15 0.95 mm 1.1 0.25 0.05 0.80 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. ...
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... NXP Semiconductors DHVQFN14: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; body 2 0.85 mm terminal 1 index area terminal 1 index area DIMENSIONS (mm are the original dimensions) (1) A UNIT max. 0.05 0. 0.2 0.00 0.18 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. ...
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... Dual D-type flip-flop with set and reset; positive edge-trigger Data sheet status Product data sheet The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. Legal texts have been adapted to the new company name where appropriate. Product data sheet Product specification All information provided in this document is subject to legal disclaimers. Rev. 4 — ...
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... Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... Dual D-type flip-flop with set and reset; positive edge-trigger NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ ...
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... NXP Semiconductors 17. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 5 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 Functional description . . . . . . . . . . . . . . . . . . . 4 7 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 7 11 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 13 13 Abbreviations ...